Sep 25 2008
Quantum Leap Packaging, Inc. (QLP), a leading provider of high performance air cavity packages for semiconductor assembly, received best session paper for "High Frequency Packaging of RF Devices" at the IMAPS Advanced Technology Workshop on RF and Microwave Packaging in San Diego.
Dr. Mike Zimmerman, CTO and Chris Lee, Director of Business Development of QLP coauthored the paper. Dr. Zimmerman presented customer data on QLP's air cavity packages, developed for LDMOS power amplifiers and high frequency applications. By utilizing unique material science and integrating it with proprietary copper flange technology, QLP is able to deliver significantly higher thermal performance and improved operating efficiency with its packages.
Data showed that QLP's packages based on QuantechTM material and copper flanges outperform current ceramic-metal materials while maintaining MIL-STD-883D reliability requirements.
"Our products are based on innovative technologies and enable next generation performance. Our packages have lowered junction temperatures by as much as 10% and increased operating efficiencies by up to 5%,” said Dr. Zimmerman. “The package has become the differentiator in product performance. Our customers have thoroughly tested our packages' reliability and validated their advantages.”
Zimmerman then presented QLP's roadmap, which targets high-frequency multi-layer applications based on new film technology.