SUSS MicroTec, supplier
of innovative solutions for 3D Integration (3DI), MEMS, Advanced Packaging and
Nanotechnology markets, launches the third generation of its MA/BA8, a manual
mask and bond aligner that offers highest process flexibility including submicron
alignment and exposure optics dedicated for thick resist exposure. In addition
it allows easy and fast upgrades to emerging technologies such as UV-nano imprinting,
microlens imprinting, UV-bonding and enhanced bond alignment. The new MA/BA8
Gen3 from SUSS MicroTec combines an unmatched resolution and light uniformity
with a high-precision alignment capability down to 0.25µm, the highest
accuracy for a mask aligner available today.
The ability to easily process virtually all kinds of wafer and substrate materials
makes the new manual aligner from SUSS MicroTec a preferred solution also for
production environments, where it addresses the growing demand for tighter process
control. Processes developed on the MA/BA8 Gen3 can be quickly transferred onto
an automated SUSS Mask Aligner for high-volume production, as both aligner platforms
are based on the same SUSS technology.
“The MA/BA8 has been designed to enable quick and effective development
of new process technologies and products”, explained Rolf Wolf, general
manager of SUSS MicroTec’s Lithography Division, “Research organizations
will benefit from the enhanced capabilities of the MA/BA8 Gen3 as it allows
them to develop their processes with industry-standard equipment.”