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Published on December 28, 2008 at 7:56 PM

3M和EV集团(EVG)已同意和解EVG 3M公司在美国地方法院对纽约南区有关临时晶圆接合系统所带来的专利侵权诉讼。

根据和解条款,其中的细节是保密的,3M公司,其客户,3M公司3M公司的晶圆支持系统的特许供应商将继续进行,销售和使用晶圆支持系统,在全球半导体和包装市场。 EVG将继续捍卫其专利组合,并保护其知识产权。

Last Update: 7. October 2011 04:48

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