University of Tokyo Places Order for Photoresist Developer from EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that they have received an order for its EVG101D, a photoresist developer, from the University of Tokyo. A first-time order win from the University, EVG's tool will be installed at a super-clean room (Class 1) in the Takeda Sentanchi Building at the University's facilities.

A versatile R&D system, the EVG101D augments an existing developer at the University and will be used to develop 100-nm and smaller patterns on masks and wafers up to 200 mm at the research facility. The patterns will be created by e-beam lithography system from the VLSI Design and Education Center (VDEC).

“This developer from EVG will allow us to reduce the amount of chemicals required in the developing process, and provide an overall cost reduction for us,” said Professor Yoshio Mita from the University of Tokyo.

“The EVG100 series is a flexible toolset that can be modified to serve as a spray or spin coater, which is ideal for an R&D environment. Additionally, this photoresist processing series is capable of coating patterned wafers, which is suitable for MEMS production,” said Yuichi Otsuka, Representative Director of EV Group Japan K.K.

The University of Tokyo has established an advanced research facility dedicated to ultra-fine lithography/nanomeasurement. The sophisticated center makes their leading-edge R&D tools for nanoprocessing and nanomeasurement available to public and private companies as well as government institution researchers. Since its establishment in 2007, these entities have used the center's high-throughput nanolithography and nano-measurement systems, as well as its super resolution transmission electron microscope and a variety of manufacturing systems atypical to semiconductor device production. The facility also provides foundry and analyses services, with university staff on-hand to support. For more information, please visit:

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