MEMS - NEMS News

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Weebit Nano Reports Excellent Test Results in Preparation for the Move to 300mm Wafers at 28nm

Weebit Nano, the Israel-based semiconductor company seeking to develop and commercialise the next generation of memory technology, has reported successful endurance results of its ReRAM cells as a key step towards moving to 300mm wafers at 28nm.

From Weebit nano Ltd. 16 Jan 2019

Scientists Create Memristive Element Made from Nanowires of Zinc Oxide Crystal

Researchers from Forschungszentrum Jülich, along with colleagues from Turin and Aachen, have successfully created a nanowire-based memristive element that works in relatively the same manner as a biological nerve cell.

6 Dec 2018

New Method Enables More Rapid Tracking of Microelectromechanical Systems

It is not known how long small gears and other tiny moving parts will last before they wear out, and there are no warning signs on when these components are going to fail, which may probably occur in just a few tenths of a second.

3 Dec 2018

SEMICON West 2016: MSIG Invites Attendees to Participate in Workshop on MEMS Devices, Sensors and Semiconductors

MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on July 13, 2016.

30 Jun 2016

Vesper's Latest Piezoelectric MEMS Microphone Brings Advanced Quiescent Sensing to Commercial Realm

Vesper, developer of the world’s most advanced acoustic sensors, today demonstrated the first commercially available quiescent-sensing MEMS device, opening the possibility of acoustic event-detection devices at practically zero power draw.

23 Jun 2016

Scientists Observe 100-Fold More Heat Transfer than Classical Predictions at Nanoscale Distances

In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close—at nanoscale distances—without touching. Led by Columbia Engineering’s Michal Lipson and Stanford Engineering’s Shanhui Fan, the team used custom-made ultra-high-precision micro-mechanical displacement controllers to achieve heat transfer using light at the largest magnitude reported to date between two parallel objects.

1 Apr 2016

New Technique to Diagnose Performance Problems of Nano-Electrical-Mechanical Systems

A team from Leti and the University of Grenoble-Alps, along with Leti’s international partners, have developed a technique to diagnose performance problems of nanoresonators, nanosensors used in industry, research and medical diagnosis.

10 Mar 2016

EV Group Launches GEMINI® Automated 300mm Wafer Bonding System for High-Volume MEMS Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its EVG GEMINI® 300-mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing (HVM).

From EV Group 7 Mar 2016

STMicroelectronics Launches High-Efficiency 6-Axis MEMS Sensor Modules for Smartphones

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed the latest generation of its highly miniaturized 6-axis MEMS inertial modules[1] with ultra-low-power design that strengthen the smartphone's emerging role as an "always-on" personal assistant and enhance user experiences for digital cameras, wearables and remote controls, game consoles, drones, and virtual reality.

From STMicroelectronics 23 Feb 2016

Picosun Revolutionizes MEMS Manufacturing with PICOPLATFORM Batch ALD Cluster Technology

Picosun Oy, the leading supplier of high quality ALD (Atomic Layer Deposition) thin film coating solutions for industrial production, has revolutionized cost-effective MEMS manufacturing with high throughput PICOPLATFORM™ batch ALD cluster technology.

From Picosun Oy 25 Jan 2016

MEMS - NEMS News

Weebit Nano Reports Excellent Test Results in Preparation for the Move to 300mm Wafers at 28nm

Scientists Create Memristive Element Made from Nanowires of Zinc Oxide Crystal

New Method Enables More Rapid Tracking of Microelectromechanical Systems

SEMICON West 2016: MSIG Invites Attendees to Participate in Workshop on MEMS Devices, Sensors and Semiconductors

Vesper's Latest Piezoelectric MEMS Microphone Brings Advanced Quiescent Sensing to Commercial Realm

Scientists Observe 100-Fold More Heat Transfer than Classical Predictions at Nanoscale Distances

New Technique to Diagnose Performance Problems of Nano-Electrical-Mechanical Systems

EV Group Launches GEMINI® Automated 300mm Wafer Bonding System for High-Volume MEMS Manufacturing

STMicroelectronics Launches High-Efficiency 6-Axis MEMS Sensor Modules for Smartphones

Picosun Revolutionizes MEMS Manufacturing with PICOPLATFORM Batch ALD Cluster Technology

Why Negative-Stiffness Vibration Isolation is the Preferred Solution for Nanotechnology Applications

The Future of Graphene

Making Cryogen Free Measurements: Challenges and Solutions

Large-Sample Atomic Force Microscope (AFM) — Jupiter XR AFM

Nicolet™ iS20 FTIR Spectrometer—FTIR Spectrometer for Collecting High-Quality Spectral Data

Intrinsic Displacement Control Mode - Alemnis Nanoindenter

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