MEMS - NEMS News

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SEMICON West 2016: MSIG Invites Attendees to Participate in Workshop on MEMS Devices, Sensors and Semiconductors

MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on July 13, 2016.

30 Jun 2016

Vesper's Latest Piezoelectric MEMS Microphone Brings Advanced Quiescent Sensing to Commercial Realm

Vesper, developer of the world’s most advanced acoustic sensors, today demonstrated the first commercially available quiescent-sensing MEMS device, opening the possibility of acoustic event-detection devices at practically zero power draw.

23 Jun 2016

Scientists Observe 100-Fold More Heat Transfer than Classical Predictions at Nanoscale Distances

In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close—at nanoscale distances—without touching. Led by Columbia Engineering’s Michal Lipson and Stanford Engineering’s Shanhui Fan, the team used custom-made ultra-high-precision micro-mechanical displacement controllers to achieve heat transfer using light at the largest magnitude reported to date between two parallel objects.

1 Apr 2016

New Technique to Diagnose Performance Problems of Nano-Electrical-Mechanical Systems

A team from Leti and the University of Grenoble-Alps, along with Leti’s international partners, have developed a technique to diagnose performance problems of nanoresonators, nanosensors used in industry, research and medical diagnosis.

10 Mar 2016

EV Group Launches GEMINI® Automated 300mm Wafer Bonding System for High-Volume MEMS Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its EVG GEMINI® 300-mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing (HVM).

From EV Group 7 Mar 2016

STMicroelectronics Launches High-Efficiency 6-Axis MEMS Sensor Modules for Smartphones

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed the latest generation of its highly miniaturized 6-axis MEMS inertial modules[1] with ultra-low-power design that strengthen the smartphone's emerging role as an "always-on" personal assistant and enhance user experiences for digital cameras, wearables and remote controls, game consoles, drones, and virtual reality.

From STMicroelectronics 23 Feb 2016

Picosun Revolutionizes MEMS Manufacturing with PICOPLATFORM Batch ALD Cluster Technology

Picosun Oy, the leading supplier of high quality ALD (Atomic Layer Deposition) thin film coating solutions for industrial production, has revolutionized cost-effective MEMS manufacturing with high throughput PICOPLATFORM™ batch ALD cluster technology.

From Picosun Oy 25 Jan 2016

Vesper Announces Collaboration with GLOBALFOUNDRIES for Piezoelectric MEMS Microphones

Vesper, the technology leader in acoustic MEMS, announced today that it is collaborating with GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, to deliver the world's first commercially available piezoelectric MEMS microphones for smartphones, wearables, automobiles, Internet of Things (IoT) devices and other high-volume markets.

21 Jan 2016

Microbots controlled individually by Magnetic 'Mini Force Fields'

Image Credit: Purdue University image/David Cappelleri Researchers from Purdue University are using a technology likened to "mini force fields" to independently control individual microrobots operating w...

14 Jan 2016

In-Depth Analysis of Global MEMS Inertial Sensors Market

MEMS inertial sensors are devices that detect and measure tilt, shock, rotation, vibration or any other types of motion. These sensors are mainly of three types, namely accelerometers, gyroscopes and magnetometers.

2 Nov 2015

MEMS - NEMS News

SEMICON West 2016: MSIG Invites Attendees to Participate in Workshop on MEMS Devices, Sensors and Semiconductors

Vesper's Latest Piezoelectric MEMS Microphone Brings Advanced Quiescent Sensing to Commercial Realm

Scientists Observe 100-Fold More Heat Transfer than Classical Predictions at Nanoscale Distances

New Technique to Diagnose Performance Problems of Nano-Electrical-Mechanical Systems

EV Group Launches GEMINI® Automated 300mm Wafer Bonding System for High-Volume MEMS Manufacturing

STMicroelectronics Launches High-Efficiency 6-Axis MEMS Sensor Modules for Smartphones

Picosun Revolutionizes MEMS Manufacturing with PICOPLATFORM Batch ALD Cluster Technology

Vesper Announces Collaboration with GLOBALFOUNDRIES for Piezoelectric MEMS Microphones

Microbots controlled individually by Magnetic 'Mini Force Fields'

In-Depth Analysis of Global MEMS Inertial Sensors Market

The Benefits of Including Floor Vibration Control for Nano-Tech Facilities over Designing ‘Quiet’ Buildings

Quantum Dot Technology In the Display Industry

Pushing the Boundaries of TEM Research with the Poseidon Select

Next Generation STACIS Active Piezoelectric Vibration Cancellation - SEM-Base VI for SEMs

eLINE Plus: Ultra High Resolution Electron Beam Lithography, Nanoengineering and Imaging

Park NX-Bio AFM: Powerful Nanoscale Microscopy for Life Science

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MEMS - NEMS News

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