Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology for global industries, reports strong growth during fiscal year 2018-2019, as a result of Group’s strategy to focus on industrial customers. The growth has continued in the first quarter of 2020.
Weebit Nano, the Israel-based semiconductor company seeking to develop and commercialise the next generation of memory technology, has reported successful endurance results of its ReRAM cells as a key step towards moving to 300mm wafers at 28nm.
Researchers from Forschungszentrum Jülich, along with colleagues from Turin and Aachen, have successfully created a nanowire-based memristive element that works in relatively the same manner as a biological nerve cell.
It is not known how long small gears and other tiny moving parts will last before they wear out, and there are no warning signs on when these components are going to fail, which may probably occur in just a few tenths of a second.
MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on July 13, 2016.
Vesper, developer of the world’s most advanced acoustic sensors, today demonstrated the first commercially available quiescent-sensing MEMS device, opening the possibility of acoustic event-detection devices at practically zero power draw.
In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close—at nanoscale distances—without touching. Led by Columbia Engineering’s Michal Lipson and Stanford Engineering’s Shanhui Fan, the team used custom-made ultra-high-precision micro-mechanical displacement controllers to achieve heat transfer using light at the largest magnitude reported to date between two parallel objects.
A team from Leti and the University of Grenoble-Alps, along with Leti’s international partners, have developed a technique to diagnose performance problems of nanoresonators, nanosensors used in industry, research and medical diagnosis.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its EVG GEMINI® 300-mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing (HVM).
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed the latest generation of its highly miniaturized 6-axis MEMS inertial modules with ultra-low-power design that strengthen the smartphone's emerging role as an "always-on" personal assistant and enhance user experiences for digital cameras, wearables and remote controls, game consoles, drones, and virtual reality.