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Results 41 - 50 of 2267 for Wafer processing
  • Oxford Instruments plc
    Supplier Profile
    Oxford Instruments designs, supplies and supports high-technology tools, processes and solutions with a focus on physical science, bioscience, environmental and industrial research and applications....
  • Filmetrics, a KLA Company
    Supplier Profile
    Filmetrics, Inc. was founded in 1995 with the mission of making thin-film measurements simple and affordable. Prior to our arrival, commercial thin-film measurement instruments cost $50,000 or more...
  • Minus K Technology
    Supplier Profile
    Minus K® Technology, Inc. was founded in 1993 to develop, manufacture and market our state-of-the-art vibration isolation products based on our patented negative-stiffness-mechanism technology....
  • HORIBA
    Supplier Profile
    HORIBA, headquartered in the United States, provides an extensive array of instruments and solutions for applications across a broad range of scientific R&D and QC measurements. HORIBA is a world...
  • SPTS Technologies
    Supplier Profile
    SPTS Technologies designs, manufactures, sells, and supports etch, deposition and thermal capital equipment, providing advanced wafer processing technologies for the microelectronics industry....
  • Anton Paar GmbH
    Supplier Profile
    Anton Paar Great people | Great instruments The “Anton Paar” success story began on January 4, 1922, when Anton Paar started his metalworking shop. Back then, it was hard to imagine that...
  • ASM International
    Supplier Profile
    ASM International N.V. is a leading supplier of semiconductor process equipment in both front- and back-end markets. The Company possesses a strong technological base, state-of-the-art...
  • ASML Special Applications
    Supplier Profile
    ASML is a world leader in the manufacture of advanced technology systems for the semiconductor industry. The company offers an integrated portfolio for manufacturing complex integrated circuits (also...
  • EV Group Unveils Next-Generation Fusion Wafer Bonder for "More Moore" Scaling and Front-End Processing
    News - 3 Dec 2018
    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all new BONDSCALE™ automated production...
  • New TriboLab CMP Provides Cost-Effective Characterization of Chemical Mechanical Wafer Polishing Processes
    News - 27 Jun 2017
    Image Credits: Bruker Nano Surfaces Division Bruker’s Nano Surfaces Division today announced the introduction of the TriboLab CMP Process and Material Characterization System, which...

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