Dynatex International has been the leader in dry process dicing and wafer dicing materials since 1958. We are committed to provide solutions for die/diode dicing and wafer processing applications -- solutions designed to increase yields, maximize throughput, and minimize operator intervention.
DXB Wafer Bonder from Dynatex International
Siyu Chen, Ph.D.
In this interview, we discuss a new approach to surface-enhanced Raman spectroscopy that utilizes nano-pockets to capture target molecules, ensuring a highly sensitive way to detect chemical processes.
Dr. Yitong Dong
Dr. Yitong Dong has recently been awarded funding to study custom composite nanocrystals, which could help to create advanced quantum communication technologies. Learn more about this project in this interview.
Roey Elnathan, Ph.D.
We take a closer look at the fusion of nanotechnology and CAR-T therapy through our interview with Dr. Roey Elnathan about a new approach that harnesses the capabilities of nanoneedles to efficiently deliver genetic materials to target cells.
The Verifire™ interferometer system provides fast and reliable measurements of surface form error.
This article outlines how Unity, Oxford Instruments’ new detector for a revolutionary new imaging technique, can be used to revolutionize imaging.
Discover the compact, fast rotary table V-610 for precision testing and manufacture.