Atomic Layer Deposition (ALD) Systems RSS Feed - Atomic Layer Deposition (ALD) Systems

Atomic layer deposition (ALD) is a thin film deposition technique that is based on the sequential use of a gas phase chemical process. The majority of ALD reactions use two chemicals referred to as precursors. ALD provides a unique method for depositing ultrathin films on surfaces.
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Kurt J. Lesker Company offer stand-alone ALD systems for basic research or completely integrated deposition systems for complex R&D applications. All of our ALD system platforms feature high speed ALD valves and integrated pumping, pressure measurement, and gas delivery packages optimized for your specific process.
Celsior™fxP is Aviza's advanced generation single wafer ALD system targeted for 300-mm production at the 90-nm node and below. Celsior fxP offers expanded revolutionary features to meet complex manufacturing requirements and the flexibility and short cycle times for R&D.
The Beneq P400A and P800 are ALD systems designed for industrial-scale production. They are ideal tools for scaling-up thin film deposition from R&D phase to full-size industrial production. The systems are dependable, industrially proven and mature in terms of technical distinction. The design is based on 25 years of continuous (24/7) operation in demanding industrial applications.
The Beneq WCS 600 is an application-specific atomic layer deposition (ALD) system designed to address various coating needs in industries. It uses a true roll-to-roll ALD process, and has a coating capacity of 400,000m2/yr.
The Oxford Instruments Plasma Technology OpAL system is a compact open-load system designed for Atomic Layer Deposition (ALD).
The Cambridge NanoTech Fiji F200 series is our most advanced ALD research and development system. The Fiji is a modular high-vacuum ALD system that accommodates a wide range of deposition modes using a flexible system architecture and multiple configurations of precursors and plasma gases. The result is a new generation ALD platform capable of doing thermal as well as plasma-enhanced deposition.
The Beneq TFS 200R is the first-ever system designed for research in Roll-to-Roll atomic layer deposition (ALD) and other forms of continuous ALD (CALD). The TFS 200R is used exclusively for depositing thin films on flexible substrates. For the first time in ALD history, the TFS 200R enables investigation in the dynamic behavior of various precursor chemistries, simulation of process suitability and evaluation of film performance in Roll-to-Roll ALD applications.
Oxford Instruments’ Ionfab 300Plus ion beam etch and deposition system provides the flexibility to operate etch and/or deposition and increases system utilisation.
Oxford Instruments’ PlasmaPro Estrelas100 deep silicon etch technology has been specifically developed for the R&D market and delivers excellent process performance and flexibility.
The TFS 500 is an ALD system designed for use in thin film coating applications. The unit incorporates leading edge design and technical solutions that enable superior quality coatings and results. In Beneq, we have approached ALD tool design with an open mind and innovative spirit. Our goal is to develop new applications and business opportunities by combining experience with invention. The TFS 500, our initial reactor model, has proven its case as a versatile tool adaptable to both in-depth thin film research and robust batch processing.
The Beneq TFS 1200 is an ALD processing module that is integrated into CIGS evaporation or rapid thermal processing (RTP) selenization lines. Deposition time for a 30 nm thick Zn(O,S) buffer layer is less than 5 min. ALD is more compact and less expensive than conventional CBD-CdS buffer layer processes.
The Beneq TFS 600 is an application-specific ALD system designed for vacuum-line integrated organic light-emitting diode (OLED) encapsulation. It provides superior ALD thin-film quality while meeting the high throughput, robustness, and reliability requirements of an industrial in-line environment.
Oxford Instruments’ FlexAL systems offer a new range of capability and flexibility in the fabrication of nanoscale structures and devices by providing remote plasma atomic layer deposition (ALD) processes and thermal ALD inside a single ALD system.
The TFS 200 is the most flexible ALD research platform ever designed for research and development. All details of the system are realized with flexibility, modularity and ease of use in mind. With the TFS 200, the freedom of coating and application development is placed completely in the hands of the operator, not limiting it by system-related restrictions.
The Savannah comes in three configurations – the S100, S200 and S300. Each one holds substrates of different sizes, up to 300mm for the S300. All come with 2 heated precursors lines, standard, with an option to have up to six precursor lines all capable of handling gas, liquid or solid precursors.
The PlasmaPro System400, from Oxford Instruments Plasma Technology, is a magnetron sputtering process tool for Physical Vapour Deposition (PVD).