Electro Scientific Industries,
Inc. (NASDAQ:ESIO), a leading provider of world-class photonic and laser
systems for microengineering applications, today announced that it has purchased
all intellectual property (IP) rights and certain hardware and software components
from XSiL Ltd., based in Dublin, Ireland. Based on robust technology, and supported
by significant IP including a substantial patent portfolio, XSiL provided high-yield
process solutions that improved die break strength and throughput for semiconductor
wafer singulation applications. The agreement became effective during ESI's
fiscal 2009 fourth quarter, enabling the Company to develop advanced thin wafer
laser dicing systems by integrating XSiL's leading IP into its Cignis
semiconductor processing platform.
“With over seven years of thin wafer laser dicing expertise, the purchase
of XSiL's IP provides ESI with valuable process development and leading-edge
technology,” said Nick Konidaris, president and CEO of ESI. “There
is a growing demand for a laser-based process that can singulate thin silicon
wafers, driven by the need to integrate more memory and functionality into mobile
devices. We plan to combine XSiL's technology IP with our Cignis platform
in order to accelerate our entry into the thin wafer laser dicing market. This
IP purchase is an example of ESI's continuing efforts to provide our global
customers with leading technology solutions that advance their product roadmaps.”
ESI is a pioneer and leading supplier of world-class photonic and laser systems
that help its microelectronics customers achieve compelling yield and productivity
gains. The company's industry-leading, application-specific products enhance
electronic-device performance in three key sectors—semiconductors, components
and electronic interconnect—by enabling precision fine-tuning of device
microfeatures in high-volume manufacturing environments. Founded in 1944, ESI
is headquartered in Portland, Ore.