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Posted in | Nanoelectronics

Ultratech to Deliver Annealing Systems to Logic Foundry in Asia for 40-nm Processess

Published on September 22, 2010 at 4:54 AM

Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that it has received a follow-on, multiple-system order for its laser spike annealing (LSA) tools from a major logic foundry in Asia.

Ultratech's LSA100A systems will be used to support the production ramp of 40-nm logic devices in 2010.  The LSA100A is the second generation of Ultratech's laser annealing production tools.  The process uniformity and cost-of-ownership advantages of Ultratech's proprietary LSA technology have been demonstrated at all major logic foundries.

"This latest multi-system order confirms the LSA100A system as the millisecond annealing tool of choice for high-volume production at yet another major logic foundry," noted Jeff Hebb, Ph.D., vice president of laser product marketing at Ultratech.  "The proprietary long-wavelength architecture of the LSA system continues to demonstrate excellent within-die uniformity, layout-independent process results, and real-time temperature control.  These advantages contribute to enhanced yields and considerable cost savings for our foundry customers.  Also, the inherent nature of our scanning LSA system and dwell time flexibility delivers a low stress process, enabling high-process temperatures, lower leakage, and minimal lithography overlay errors.  As a result, the LSA100A provides our customers with added value for their 40-nm processes, while enabling extendibility to the 28-nm node and beyond." 

Ultratech's LSA100A Laser Annealing System

The LSA100A laser spike annealing system enables junction activation and other front-end advanced annealing processes for the 65-nm node and beyond.  Building on the success of its predecessor the LSA100, the LSA100A provides both an improvement in the technical capabilities for advanced nodes and a significant increase in productivity.  Ultratech's LSA100A delivers uniform temperature across the wafer independent of the device layout while providing a low overall cost of ownership.  LSA100A provides superior technical performance and operational flexibility critical for advanced semiconductor manufacturing. 

Source: http://www.ultratech.com/

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