By Cameron Chai
Imec has declared that it has successfully completed the testing of a
chipset featuring custom superior-quality extreme ultra violet (EUV) sensor
dies.
The company is now integrating the chipset in ASML’s EUV lithography tools
called the NXE:3100 in the field to improve their critical dimension and overlay
tool performance.
Wafer with EUV sensor dies, produced on imec’s 200mm CMORE line
This accomplishment proves that Imec’s CMORE business line is now prepared to
offer custom specialty chip solutions to its partners. The sensors were
developed to meet the standard specifications and designs of ASML, with focus on
high sensitivity and lifetime to high and direct EUV irradiation dosages.
Two of the sensors are specifically developed to align, calibrate, and focus
lens systems of the lithography tool. They have been included in functional
sensor modules and also incorporated in the NXE:3100 systems in the field. A
third sensor is engineered to check the EUV dosage of the NXE:3300. Imec’s next
task is to develop and test these sensors for the NXE:3300 EUV lithography tools
by this year end.
Imec’s CMORE initiative allows companies to realize their novel designs into
compact packaged microsystems. The CMORE toolbox features a broad range of
device technologies on 200 mm that include packaging, image sensors, MEMS,
Si-photonics and CMOS, and testing, design and dependability. Further to these
EUV sensors, the company’s CMORE initiative will design chip solutions for
photolithography, high-end specialty imaging, power and energy management and
bio-sensing.
Source: http://www2.imec.be