By Cameron Chai
Toppan Printing’s subsidiary, Toppan Photomasks has declared plans to invest $20 million to expand the production capacity and technology capabilities of its Shanghai joint venture facility in order to meet the growing demand of the semiconductor industry in China.
Toppan Photomasks runs a company named Toppan Photomasks Company Limited, Shanghai, through a joint venture partnership with the Shanghai Institute of Microsystem and Information Technology. Through this investment, the company will significantly expand the production capacity of photomasks utilized in semiconductor device production, and enhance its capability to manufacture more detailed photomasks having design features down to 90 nm.
As part of the expansion plan, Toppan Photomasks will build an addition production facility measuring 4,950 sq. m nearby the existing facility in Shanghai. The new facility will feature clean room and improved capabilities of lithography, inspection, process and repair. Construction is slated to start in Q1 2012, with completion scheduled in December 2012.
Toppan Photomasks produces photomasks to major semiconductor device manufacturers and design houses, including HeJian Technology (Suzhou), Advanced Semiconductor Manufacturing, Grace Semiconductor Manufacturing, Shanghai HuaLi Microelectronics, CSMC Technologies and Shanghai Hua Hong NEC Electronics.
The Executive Vice President of Worldwide Sales at Toppan Photomasks, Michael Hadsell stated that the company has continuous investment plans to meet the demand of its customers for photomasks. The President of the Shanghai Institute of Microsystem and Information Technology and academician of the Chinese Academy of Sciences, Professor Xi Wang stated that the institute believes that Toppan Photomasks’ new 90 nm photomask technology will be a key in uplifting the competitiveness of the semiconductor products in China.