NEXX Systems, a
leading provider of process equipment for advanced wafer-level packaging applications,
today announced its participation in IMEC's Industrial Affiliation Program (IIAP)
on 3D integration. As a member of this program, NEXX Systems will install a
Stratus S300-FX electrodeposition system at IMEC's facility in Leuven, Belgium
for joint research and development of the metallization of through silicon vias
(TSVs) and micro-bumping. The TSVs and micro-bumps are fabricated with electrodeposition
technology and play a key role in 3D integration.
"We are delighted to continue our partnership with NEXX Systems and are
confident that the Stratus will give our partners leading-edge electrodeposition
technology for 3D integration," explained Eric Beyne, program director
of the Advanced Packaging and Interconnect Center at IMEC.
"3D integration is an exciting new technology that addresses the ever-increasing
demands for smaller, more complex, electronic devices," said Richard Post,
NEXX's CEO. "Our partnership with IMEC will enhance continuing efforts
to develop robust, low cost electroplating solutions that will enable future
products for consumer electronics as well as automotive, medical, and office
networking applications."