Apr 23 2009
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company will increase its production capacity in light of strong order intake in its first half year of fiscal 2009. In fact, EV Group plans to introduce an additional production shift later this month to extend its normal hours of operation to meet delivery targets. Ended March 31, the company witnessed a rise in order intake exceeding forecasted expectations through Q2 '09 driven by continued demand from the burgeoning 3D IC/through-silicon via (TSV) and nanoimprint lithography markets.
Commenting on today's announcement, Dr. Werner Thallner, EV Group's Executive Operations Director, noted, "We are taking measures to ramp up production to not only meet current demand but also future demand, which we expect to remain strong despite the current economic situation. Meeting our delivery targets is an essential part of our business, and an ongoing commitment to our customers. An additional production shift will prepare us for future growth and enable us to shorten lead times that will in turn allow our customers to quickly ramp production and meet their time-to-market objectives."
Despite the current global economic slowdown, EV Group remains optimistic about its outlook for 2009 and beyond. This is the result of the company's diversified technology, process and equipment portfolio as well as its ongoing, substantial investment in R&D and close cooperation with industry partners, universities and research institutions.
Advanced, cost-effective production equipment and superior process capabilities, quality and support make EVG the partner of choice, both in R&D and high-volume production environments. The company maintains dominant share of the market for wafer bonding equipment, and is a market and technology leader in lithography for advanced packaging and nanotechnology.