Rudolph Technologies,
Inc. (NASDAQ: RTEC), a worldwide leader in the design, development, manufacture
and support of high-performance process control metrology, defect inspection
and data analysis systems used by semiconductor device manufacturers, announced
today the sale of its Explorer® Inspection Cluster to a major memory manufacturer
in Taiwan. The Explorer is a new multi-surface inspection system designed to
deliver fast, accurate and reliable macro defect inspection at a low cost of
ownership.
“The order for this new product is an encouraging example of technology
buys that we are beginning to see in the industry,” said Ardy Johnson,
vice president of marketing at Rudolph. “While it is too early to forecast
a measurable market recovery, we are excited to report orders like this one
that are from market segments that have previously been at a standstill.”
The Taiwan DRAM manufacturer has ordered the Explorer ‘total solution
package’ that includes the AXi940™ front side inspection module,
B30™ backside inspection module, E30™ edge inspection module, the
Discover® software package for inline defect analysis and data management,
and TrueADC™ software for inline automatic defect classification. Rudolph’s
total solution not only can improve yields by performing high-speed automated
inspection on the frontside of the wafer, but also is able to quickly identify
edge and/or backside defects, such as cracks, chip-outs, delamination, residuals,
particles and flaking.
Scott Balak, Rudolph’s all-surface inspection product manager adds, “Edge
bevel inspection, in particular, is becoming more important as we move through
45nm and beyond, and especially as immersion lithography has been introduced
into advanced manufacturing processes. Defects originating in non-exposure areas,
including streets, partial devices and the edge of the wafer, all have the potential
to create problems within the immersion environment. Edge-related processes,
such as edge bead removal, need to be monitored closely to control performance
and defectivity.”
The Explorer Inspection Cluster is a modular approach to wafer inspection consisting
of one or more inspection modules for front, back and edge inspection. Sophisticated
queue management and the option of up to four load ports helps to ensure maximum
throughput and efficiency. The improved sensitivity of the edge and backside
modules permits the detection of defects down to one micron on patterned wafers.
Discover is an inline defect analysis and data management system designed to
seamlessly handle advanced macro frontside, edge and backside inspection results.
When the E30 and B30 modules are paired with the frontside module, correlation
of defect data from all surfaces provides faster more efficient response to
defectivity issues.