Optomec, Inc. and Vertical
Circuits, Inc. (VCI) announced today that they are collaborating in the development
of a high density 3-dimensional interconnect solution that will enable multi-functional
integrated circuits to be stacked and vertically interconnected in high performance
Multi-Chip Packages (MCPs). The solution will combine the unique fine feature
capabilities of Optomec's patented Aerosol Jet® material deposition
system with the cost and functional benefits of VCI's patented Conformal
Interconnect Technology, used currently in high density memory components and
removable storage cards. The result will uniquely enable the combination of
multiple memory devices plus logic and mixed signal ASICs into single packages
with electrical/thermal performance, size, and cost benefits over alternative
3D technologies.
The solution is initially targeted to meet the continuing miniaturization needs
of mobile communications product manufacturers, and will ultimately impact a
broad range of devices that require cost-effective, high performance, and small
form factor component solutions. As part of the collaboration, Optomec has installed
one of its standard systems at VCI, and the two companies are working closely
together to optimize the solution for production in 2010.
Simon McElrea, Vertical Circuits' Product Development VP, stated, “Vertical
Circuits' approach is to simplify the 3D product solution. Our unique interconnect
technology and process flow have been developed to significantly reduce the
manufacturing complexity vs. traditional wire-bond and package-on-package (PoP)
based solutions. Our conformal interconnect technology minimizes the package
form factor and provides a short, high performance signal path without the need
to wait for complex TSV-based solutions. We are delighted to be working with
Optomec, the leader in fine conductor application tools.”
The Aerosol Jet solution is ideally suited for production of fine pitch 3D
conformal interconnects, since it is the only cost-effective technology capable
of producing highly conductive traces as small as 10 micron over complex die
stack geometries. Traditional multi-die packaging interconnect solutions such
as Wire Bonding and PoP are complex and costly, and have limited scalability
to support the higher frequency/short path signals required for next generation
portable devices. Similarly, cost and time-to-market concerns remain a significant
issue for emerging alternatives such as Through Silicon Via (TSV).
Dave Ramahi, Optomec President/CEO, commented that “We are delighted
to work in close partnership with VCI to introduce this high value chip packaging
solution. As a near-term, low-cost alternative to the future promise of Through
Silicon Via, we believe our solution will soon see demand well beyond the needs
of our initial mobile communications product applications.”
To download a video of the printing of vertical interconnects and other information,
click here.
VCI is a global supplier of advanced die level vertical interconnect packaging
technology, products, services and intellectual property for the manufacture
of low cost ultra high-speed/high-density semiconductor components. VCI develops
cost effective advanced interconnect technology for high density and high performance
applications. Their patented ViP™ (Vertical Interconnect Pillar) process
bridges the gap between current wire bond based product solutions and tomorrow's
Through Silicon Via (TSV) technology. For more information on VCI, please visit
their website at www.verticalcircuits.com.
Optomec is the world-leading provider of additive manufacturing systems for
high-performance applications in the Photovoltaic, Electronics, Biomedical,
and Aerospace & Defense markets. These systems utilize Optomec's proprietary
Aerosol Jet printed electronics and LENS powder-metal fabrication technologies.
The company has a global customer base of industry-leading manufacturers. For
more information on Optomec's Aerosol Jet deposition system and VCI, visit
us at Intersolar/SEMICON West in booth #8363.