The World biggest semiconductor foundry from Taiwan has placed a combined
order for the Mask Defect Repair System MeRiT® HR 32 and the Aerial Image
Measurement System AIMS™ 32-193i from Carl
Zeiss to prepare for the production of next generation high-end photomasks.

AIMS 32-193i and MeRiT HR 32 enable the production of zero-defect photomasks at 32nm node and beyond.
“As one of the most advanced foundries our customer has to invest strategically
to ensure zero defect photomask production for the upcoming 32 and 22nm nodes.
For the introduction of the next technology nodes the new generation of AIMS
and MeRiT systems are essential components to ensure manufacturing of high-quality
photomasks with zero-defects.” explains Dr. Oliver Kienzle, Managing Director
of SMS Division of Carl Zeiss SMT.
Last year Carl Zeiss launched the mask qualification and repair systems for
the 32nm node. “AIMS and MeRiT are well established in the market as a
closed-loop solution for defect free masks, especially at 65nm and 45nm node.
Thanks to the close cooperation with key customers we could develop further
advanced technology to derive strong next generation systems.” Kienzle
continues. He highlights that customers especially appreciate the fully flexible
illumination scheme of the AIMS 32-193i and the new high-stability platform
concept of the MeRiT HR 32 system extendible to future technologies including
EUV.
The e-beam based mask repair system MeRiT HR32 employs two strategies in parallel
to meet the demands of 32 nm lithography. The required repair quality in terms
of resolution and placement accuracy is addressed by a novel e-beam platform
that includes an actively controlled mini-environment. This feature provides
a high level of thermal and mechanical stability. The enhanced e-beam process
assisted by a flexible, high-capability process gas supply system improves etch
stability and minimum repair size. Furthermore it enables new and challenging
mask technologies like OMOG-type and EUV masks. The MeRiT technology builds
a closed-loop solution together with AIMS™ for defect repair and repair
verification. The new AIMS 32-193i enables accurate emulation of 32nm lithography
techniques such as Double Patterning Technology, Source Mask Optimization and
Computational Lithography.
Based on the broad expertise of Carl Zeiss with scanner lens technologies the
system ensures scanner-like imaging performance by the new LITO® grade optics.
An advanced illumination system allows the emulation of all kinds of 193nm illumination
settings. For the first time in AIMS history variable transmission in the illumination
pupil is now available with AIMS 32-193i.