Mobius to Discuss UV Fiber Laser Application for Thin Wafer Processing at 2010 CMOS Workshop

Mobius Photonics, an innovative producer of short pulsed fiber laser sources (IR, green, and UV laser), will participate in the 2010 CMOS (Communications, Microsystems, Optoelectronics, Sensors) Emerging Technologies Workshop through an invited presentation from Vice President of Business Management Kiyomi Monro.

Slated for May 21st in Whistler, British Columbia, Canada, Monro's talk will focus on ultraviolet (UV) fiber laser technology and its relevance for thin wafer processing.

Monro will discuss applications such as silicon wafer dicing, scribing and through silicon via (TSV) drilling, where UV fiber laser technology shows promise in both material processing quality and throughput. Mobius Photonics recently demonstrated a fiber laser that produces high-quality, micron-scale cuts, scribes and holes in a variety of materials.

CMOS workshops are annual British Columbia-based conferences that provide companies and academic institutions a platform for showcasing their technologies, innovations, products and services. They are intended to encourage collaboration and foster discussions on emerging technologies between researchers, academics, industry experts, investors and entrepreneurs from around the globe.

The CMOS Emerging Technologies Workshop runs from May 19 through May 21, 2010. Monro's presentation is scheduled for May 21st at 9:40 am during the photonics session (5A).

Source: http://www.mobiusphotonics.com/

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