In another step toward driving the maturity of 3D IC integration, SEMATECH's
3D Interconnect program announced today the completion of its 300 mm 3D IC pilot
line, operating at the College of Nanoscale Science and Engineering's
(CNSE) Albany NanoTech Complex.
Dedicated to via-mid 3D applications, SEMATECH's development and exploratory
platform includes all processes and test vehicles necessary to demonstrate the
viability of the via-mid technology in conjunction with advanced CMOS.
“Our mission is to make 3D through-silicon via (TSV) both manufacturable
and affordable. We will prove its very real advantages over conventional, two-dimensional
designs—especially in increased functionality and performance,”
said Sitaram Arkalgud, director of 3D Interconnect at SEMATECH. “The completion
of our 300 mm R&D line is a significant step toward demonstrating technology
solutions for TSV high-volume manufacturing.”
Centered on 5µm x 50µm TSVs, the processes include TSV formation
and metallization, wafer and die alignment, bonding, thinning, and the necessary
metrology for these integration sequences. Supported by the conventional CMOS
processing capabilities of CNSE, SEMATECH researchers are working jointly with
chipmakers, equipment and materials suppliers, and universities on device interactions
for fabrication at the 65 nm node for planar and future scaling to 30 nm for
planar and non-planar CMOS technologies.
“The integration of the 3D Interconnect pilot line by SEMATECH at CNSE's
Albany NanoTech Complex further enhances the leading-edge research and development
capabilities at the UAlbany NanoCollege,” said Richard Brilla, vice president
of strategy, alliances and consortia at CNSE. “This marks another critical
step forward in accelerating advanced manufacturing for innovative nanoelectronics
Arkalgud added, “Our program provides our members with access to complete
300 mm R&D capability in 3D, allowing them to evaluate tools, process modules
and even integration sequences in a realistic setting. Moreover, SEMATECH is
playing a strategic role in working with the industry to drive manufacturability
and forge consensus on technology options, standards, and cost modeling.”
Launched in 2005, SEMATECH's 3D program was established to deliver robust
300 mm equipment and process technology solutions for high-volume TSV manufacturing.
The 3D program has been actively engaging with leading-edge equipment and materials
suppliers and leveraging their expertise to deliver manufacturable process solutions.
In 2009, the program began to expand considerably to include development and
demonstration of 300 mm tooling, materials, and process module solutions necessary
for 3D TSV manufacturing for 300 mm wafers in 2012 and beyond.
In addition, SEMATECH's 3D program is developing a reference flow which
contains the critical elements of interest in processing and metrology for its
members. The use of a common reference flow will help drive consensus among
members and the industry, and lend validity to a cost model.
3D ICs will play an important role in semiconductor manufacturing, given their
potential to alleviate scaling limitations, increase performance by reducing
signal delays, and reduce cost. TSVs can improve electrical performance, lower
power consumption, enable the integration of heterogeneous devices, shrink device
size, and reduce cost.