Nov 12 2010
DCG Systems, Inc. today announced the P3X Cobra, the newest addition to its line of focused ion beam circuit edit systems designed to meet its customers' complex edit challenges, even at advanced 22 nm device process technologies.
The P3X Cobra delivers impeccable ion beam performance from 2keV to 30keV beam energies. Its image resolution of 3 nm with impressive milling performance is pivotal to device editing on 32 nm, 22 nm and future IC fabrication processes.
"DCG, as the market leader, continues to push the boundaries of our technologies to address the challenges of 22 nm and beyond," said Dr. Israel Niv, President and CEO of DCG Systems. "The new P3X Cobra is our latest development in which we have integrated a superb, state-of-the-art FIB column into our P3X platform, which has for years been a workhorse in the industry."
DCG Systems products will be showcased November 16-17 at the 36th annual International Symposium for Testing and Failure Analysis (ISTFA 2010, Booth #614) to be held at the InterContinental Hotel Dallas, Addison, Texas.
At ISTFA, DCG will also feature live demonstrations on the ELITE™ IR lock-in thermography system, which provides real-time defect localization without deprocessing components, in order to locate a variety of defects such as line shorts, ESD damage, oxide damage and device latch-ups. DCG is also introducing a direct FIB link to Tool Corporation's LAVIS navigation software.
DCG will give a technical presentation at ISTFA which presents a case study of the successful application of its patented LVI technology to scan shift failure analysis, demonstrating a 100% successful confirmation of analysis results through physical verification.
Source: http://www.dcgsystems.com/