Feb 16 2011
Dow Electronic Materials (NYSE:DOW), a leader and innovator in chemical mechanical planarization (CMP) technology for the global semiconductor industry, today announced that its Japanese joint venture, Nitta Haas Inc., has been recognized with a 2010 supplier award from Siltronic AG for its Excellent Product Development in Polishing Pad Technology. Nitta Haas was honored for its years of cooperation with Siltronic, its reliability and timeliness in supplying high quality products which are crucial to the performance of the wafer polishing steps and its commitment to customers.
“Since the start of our Joint Development Project for new polishing pads, our confidence in developing a state-of-the-art polishing process for next generation wafers has been strengthened by Nitta Haas’ improvements and development activities,” said Dr. Christoph von Plotho, president and CEO of Siltronic. “These are achievements that we do not take for granted given the high quality standards and complex technical challenges in our industry. This award acknowledges Nitta Haas’ consistent high level of support of our organization.”
“Recognition for our customer support efforts is the most valuable feedback we can receive from a customer,” said Dr. Masaharu Kinoshita, president of Nitta Haas. “The hard work of the Nitta Haas team led by account manager Pauric O’Donnell with the support of Dow Electronic Materials’ global organization enabled us to achieve this award from Siltronic. We wish to thank Siltronic for this honor and look forward to continuing our successful partnership with them as they continue to move forward with their silicon wafer polishing technology development.”
Dr. Kinoshita and Mr. Koichi Yoshida, general manager of Nitta Haas’ Product Technology Department, accepted the award on January 18, 2011 at a ceremony held at Siltronic’s Headquarters in Munich, Germany.