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  • Equipment
    The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class...
  • Equipment
    The Renishaw structural and chemical analyser (SCA) unites two well-established technologies, scanning electron microscopy (SEM) and Raman spectroscopy, resulting in a powerful and unique technique...
  • Equipment
    SensaProbes are highly recommended for early stage scans and student use. Applied NanoStructures SensaProbes can be used for tapping and contact mode and force modulation applications.
  • Equipment
    Applied Nanostructures Doped Diamond Probes offers a unique combination of hardness and conducting tip. These probes are nanofabricated using highly doped single crystal silicon with unparalleled...
  • Equipment
    Applied Nanostructures silicon nitride probes contains the world's first truly hybrid probes. They are also the only commercially available probes that allow for high resolution imaging in fluid...
  • Equipment
    Applied Nanostructures silicon probes are available in different configurations such as long and short cantilever for tapping and non-contact mode applications, multi-cantilever probes for force...
  • Equipment
    Carbon Design Innovations' (C|D|I) carbon core high-resolution probes (CCHR) atomic force microscopy (AFM) start with a core carbon nanotube (CNT) that is then further processed and stabilized with...
  • Equipment
    The CCHAR high-aspect ratio CNT AFM probe, are designed for critical dimension measurements and imaging high-Z structures in materials science, metrology and life science applications. The standard...
  • Equipment
    Fast, quantitative, elemental analyses of difficult samples are hallmarks of the DC Arc approach. Few other techniques can challenge the ease-of-use or productivity of DC Arc when it comes to samples...
  • Equipment
    The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.

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