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Results 1 - 10 of 73 for Wafer bonders
  • Dynatex International
    Supplier Profile
    Dynatex International has been the leader in dry process dicing and wafer dicing materials since 1958. We are committed to provide solutions for die/diode dicing and wafer processing applications...
  • DXB Wafer Bonder from Dynatex International
    Equipment
    The DXB is used for mounting wafer to substrate improves bond quality and repeatability while improving process time during lapping, polishing, or dicing.
  • SST International
    Supplier Profile
    SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has...
  • SST International MODEL 3180/3190 Wafer Bonders
    Equipment
    The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.
  • SUSS MicroTec AG
    Supplier Profile
    SUSS MicroTec is one of the world's leading manufacturers of production and test equipment in the field of microelectronics. Our products are geared towards market segments for high-quality...
  • EV Group
    Supplier Profile
    EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology...
  • EVG540 Automated Wafer Bonding System from EV Group
    Equipment
    EVG540 Automated Wafer Bonding System is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging,...
  • SB6/8e Semi-Automated Wafer Bonding System from SÜSS MicroTec AG
    Equipment
    The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class...
  • EV Group Unveils Next-Generation Fusion Wafer Bonder for "More Moore" Scaling and Front-End Processing
    News - 3 Dec 2018
    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all new BONDSCALE™ automated production...
  • SUSS MicroTec Wafer Bonders Continue to Capture Major Market Share in Advanced MEMS Manufacturing
    News - 10 Feb 2009
    MST.factory dortmund, a renowned center of competence for micro and nanotechnology based in Germany, has purchased the CB8 High Performance Wafer Bonder from SUSS MicroTec (FWB:SMH)(GER:SMH), a...

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