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EVG540 Automated Wafer Bonding System from EV Group

EVG540 Automated Wafer Bonding System from EV Group

The EVG540 Automated Wafer Bonding System is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications. Based on modular design the EVG540 provides a proven solution for later transition of wafer bonding processes from R&D stage to large-scale manufacturing on our fully integrated production bonding systems.

Features of the EVG540 Automated Wafer Bond System

  • Fully-automated processing with automated loading and unloading bond chucks
  • Single chamber production bonder
  • Automatic handling of up to four bond chucks
  • Compliant to high safety standards
  • Modular bond chamber design
  • Active bottom side cooling

Specifications of the EVG540 Automated Wafer Bond System

  • Heater size = Max. wafer diameter: 150 mm, 200mm, 300mm
  • Min. wafer diameter: 150mm heater: 50mm; 200mm heater: 100mm, 300mm heater: 200mm
  • Bond chuck system / Alignment system:
  • 150mm heater: EVG620, EVG6200, IQ Aligner, SmartView
  • 200mm heater: EVG6200, IQ Aligner, SmartView
  • 300mm heater: IQ Aligner, SmartView
  • Max. contact force: 3.5kN, 7kN, 10 kN, 20 kN, 40 kN, 60 kN
  • Max. temperature: 550°C (600°C optional)
  • Vacuum: 1E-3 mbar (standard), 1 E-5 (optional), vacuum controller and process gas lines optional
  • Power supply for anodic bonding: 0-2.000V / 50mA
  • Loading chamber: 3-axis robot
  • Process (recipe) compatible with GEMINI
  • Max. number of bond chambers: 1
  • Customer / application: pilot-line +manufacturing, high volume manufacturing
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