The Advantages of Using the Zeta 3D Optical Profiler for Edge Inspection and Metrology

The KLA Tencor3D™ optical profiler is an ideal instrument (Figure 1) for edge inspection and metrology, with superior features such as XOD inspection, edge defect review edge trim step height and X-Y-è shift. It is a non-contact 3D optical profiler with an inspection option.

The Zeta-580 Optical Profiler with 200/300mm EFEM and automated s/w for Edge Inspection and 3D Metrology with full wafer mapping

Figure 1. The KLA Tencor-580 Optical Profiler with 200/300mm EFEM and automated s/w for Edge Inspection and 3D Metrology with full wafer mapping

Key Features of the KLA Tencor3D™

The key features of the KLA Tencor3D™ include:

  • Automated extreme edge (XOD) examination of the wafer
  • For calibration and monitoring operations
  • Full wafer inspection report with classification of defects
  • Possible to 3D optical profile defects
  • XOD edge trim step height
  • In-built microscope review capability
  • Corresponding to 100 percent bump inspection instruments
  • Manual or automated 200 and 300 mm systems are available

Edge Trim is critical for wafer thinning and dicing. Zeta-580 can be used to measure the step height at the extreme edge (XOD) of the wafer.

Figure 2. Edge Trim is critical for wafer thinning and dicing. KLA Tencor-580 can be used to measure the step height at the extreme edge (XOD) of the wafer.

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