The Hitachi IM4000II and ArBlade 5000 ion milling systems deliver high-precision sample preparation for scanning electron microscopy. Suitable for metals, semiconductors, polymers, ceramics, and layered materials, they produce high-quality cross-sections and polished surfaces with minimal artifacts.
Designed for academic research, industrial quality control, and materials science laboratories, both systems provide fast, repeatable results - making them indispensable tools for advanced electron microscopy applications.
- Cross-section & flat milling: Flexible options for different applications
- Cryogenic cooling (optional): Reduces damage to temperature-sensitive samples
- High milling rate: Fast and efficient sample preparation for hard materials
- Optimized for SEM & AFM: Compatible with Hitachi and third-party microscopes
- User-friendly interface: Intuitive touch-screen controls for ease of use
Image Credit: Hitachi High-Tech Europe
IM4000II
The IM4000II is an all-in-one system capable of both cross-section and flat milling, offering laboratories a flexible and reliable solution for essential sample preparation needs.
Image Credit: Hitachi High-Tech Europe
ArBlade 5000
The ArBlade 5000, a more advanced system, offers a higher milling rate and wide-area cross-section milling. It is ideal for demanding applications and laboratories that require high throughput.
Image Credit: Hitachi High-Tech Europe
Features and Benefits
Fast and Precise Milling for a Wide Range of Materials
Reduce turnaround times while maintaining sample integrity.
- The IM4000II delivers a milling rate of 500 µm/hour, while the ArBlade 5000 achieves 1 mm/hour or more (for Si samples with a 100 µm protrusion).
- Both systems are well-suited for hard materials such as metals and semiconductors that require extended milling.
Image Credit: Hitachi High-Tech Europe
Cross-Section and Flat Milling for Flexible Sample Preparation
Get the flexibility to prepare samples the way your work demands.
- Cross-section milling creates smooth, undistorted surfaces without introducing mechanical stress - ideal for studying the internal structures of composite materials, multilayer films, and electronic components.
- Flat milling removes surface artifacts to deliver clean, high-contrast surfaces, making it especially valuable for applications such as EBSD.
Image Credit: Hitachi High-Tech Europe
Wide-Area Cross-Section Milling (ArBlade 5000 Only)
Prepare large samples with ease and confidence.
- With milling capability up to 10 mm in width, the system is well-suited for electronic devices and industrial materials.
- It ensures a uniform cross-section across larger samples, enhancing both imaging accuracy and analytical reliability.
Image Credit: Hitachi High-Tech Europe
Cryogenic Cooling for Temperature-Sensitive Samples
Preserve sample integrity for high-resolution imaging.
- The optional Cooling Temperature Control feature for the IM4000II and ArBlade 5000 prevents heat damage to delicate materials such as polymers.
- Maintains a stable temperature range from 0 °C to -100 °C using liquid nitrogen
Image Credit: Hitachi High-Tech Europe
Seamless Integration with Scanning Electron Microscopes (SEMs)
Ensure contamination-free imaging of air-sensitive samples.
- Compatible with Hitachi SEMs and third-party systems for more efficient operations
- The Air Protection Holder Unit (available for both the IM4000II and the ArBlade 5000) allows samples to be transferred to a SEM or AFM without being exposed to air.
Image Credit: Hitachi High-Tech Europe
Applications Gallery
Metals and Alloys
Prepare cross-sections of hard materials for microstructural analysis. Image Credit: Hitachi High-Tech Europe
Batteries
Cross-section of Li Ion Battery Anode. Image Credit: Hitachi High-Tech Europe
Electronics and Semiconductors
Expose layers and interfaces in integrated circuit. Image Credit: Hitachi High-Tech Europe
Polymers and Soft Materials
Prevent deformation in temperature-sensitive samples. Image Credit: Hitachi High-Tech Europe
Multilayer Films and Coatings
Study layer composition and adhesion quality. Image Credit: Hitachi High-Tech Europe
Hard Materials
Cross-section milling example. Image Credit: Hitachi High-Tech Europe
Specifications
Source: Hitachi High-Tech Europe
| |
IM4000II |
ArBlade 5000 |
| Gas Used |
Ar (argon) gas |
Ar (argon) gas |
| Accelerating Voltage |
0 to 6 kV |
0 to 8 kV |
| Maximum Milling Rate (estimated for Si samples and 100 μm protrusion) |
500 μm/h or more |
≥ 1 mm/h |
| Maximum Milling Width |
Not available |
10 mm |
| Maximum Specimen Size |
20(W) x 12(D) x 8(H) mm |
20(W) x 12(D) x 8(H) mm |
| Sample Moving Range |
X: ±7 mm, Y: 0 to +3 mm |
X: ±7 mm, Y: 0 to +3 mm |
| Ion Beam Intermittent Irradiation |
ON/OFF setting (1 sec to 59 min 59 sec) |
Standard function |
| Swing angle |
±15 °, ±30 °, ±40 ° |
±15 °, ±30 °, ±40 ° |
| Wide-Area Cross-Section milling |
Not available |
Up to 10 mm width |
| Flat Milling Area |
φ 32 mm |
φ 32 mm |
| Maximum Flat-Milled Sample Size |
φ 50 x 25(H) mm |
φ 50 x 25(H) mm |
| Rotation Speed |
1 rpm, 25 rpm |
1 rpm, 25 rpm |
| Tilt Range |
0 to 90 ° |
0 to 90 ° |
| Cooling Temperature Control (optional) |
0 to -100 °C via LN2 |
0 to -100 °C via LN2 |
| Higher Beam Tolerance Mask (optional) |
2x beam tolerance (Cobalt-free) |
2x beam tolerance (Cobalt-free) |
| Stereo Microscope Unit (optional) |
15x to 100x, Binocular/Trinocular |
15x to 100x, Binocular/Trinocular |