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Rudolph Technologies Announces the Availability of its New S3000S Metrology System

'Bullet Fingerprinting' Being Advanced in New Ways

'Bullet Fingerprinting' Being Advanced in New Ways

Veeco Joins Microsystems Industrial Group

Veeco Joins Microsystems Industrial Group

System Enables SEMATECH To Verify Alignment Of Bonded Wafers And Through Silicon Vias

System Enables SEMATECH To Verify Alignment Of Bonded Wafers And Through Silicon Vias

Attachments Allow Use of LED-Based Microscope for Fluorescence Applications

Attachments Allow Use of LED-Based Microscope for Fluorescence Applications

Nanometrics Receives Orders for VerteXTM and Multiple RPMBlueTM PL Mapping Metrology Systems

Variable Pressure Mode Extends Analytical Capabilities

Variable Pressure Mode Extends Analytical Capabilities

CRAIC Technologies Introduces QDI 2010 Film Microspectrophotometer Designed to Measure Thickness of Thin Films PV Cells

CRAIC Technologies Introduces QDI 2010 Film Microspectrophotometer Designed to Measure Thickness of Thin Films PV Cells

JPK Instruments Announces the Opening of Their First Offices in Japan

JPK Instruments Announces the Opening of Their First Offices in Japan

Physicists Succeeded in Demonstrating the Electronic Structure of an Interface in a Solid for the First Time

Physicists Succeeded in Demonstrating the Electronic Structure of an Interface in a Solid for the First Time

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