Sep 12 2008
IBM, Chartered Semiconductor Manufacturing Ltd. and Samsung Electronics, Co., Ltd. today announced the annual Common Platform Technology Forum will be held Tuesday, September 30, 2008 at the Santa Clara Convention Center. This free, day-long event offers insights and presentations about the technical breakthroughs enabled through the companies’ ground-breaking Common Platform technology initiative.
This year’s event, entitled “Access Innovation,” will focus on the latest technological advancements available to Common Platform customers, including 32-nanometer (nm) high-k metal gate (HKMG); developments in computational scaling technology, airgap and materials innovation; and energy-aware multiprocessing on leading-edge technology.
“A major benefit to our mutual customers through the Common Platform model is access to innovation resulting from deep research and joint development. This not only includes IBM, Chartered and Samsung, but also joint development partners Infineon, Freescale, STMicroelectronics and Toshiba. The result is an accelerated technological roadmap that leverages leading-edge materials science and process technology innovations and delivers them through a flexible, customer-oriented business model,” said Kevin Meyer, vice president of industry marketing and platform alliances at Chartered, on behalf of the Common Platform. “At this year’s event, we will be talking about the most advanced techniques for dealing with pressing design and manufacturing challenges as we move down the technology roadmap.”
The event’s keynote speakers include Dr. Gary Patton, vice president of the IBM Semiconductor Research and Development Center; Luis Pineda, senior vice president of marketing and product development at Qualcomm CDMA Technologies; Tudor Brown, president of ARM and Tommi Uhari, executive vice president and general manager, ST-NXP Wireless.
Technical sessions include presentations on low-power design implementation, advanced design methodologies, and a tutorial on 32nm HKMG technology.
At the Solution Provider Pavilion, where more than 30 providers from leading EDA, IP, library, mask, back-end and design services companies will be on display. Platinum Sponsors of the Technology Forum includes Amkor, ARM, Cadence, Mentor Graphics and Synopsys, while Dai Nippon Printing, Takumi and True Circuits are Gold Sponsors.
Other exhibitors include Accent, Analog Bits, Apache, Aragio, ASE Group, Cosmic Circuits, Denali, eMemory, Extreme DA, GSA, Hoya, Kilopass, Mixel, MoSys, PDF Solutions, Photronics, QThink, S3, Snowbush, SOCLE, Springsoft, STATS ChipPAC, Time to Market, Toppan Photomasks, UTAC, VeriSilicon and Virage Logic.