EV Group (EVG), a leading
supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology
and semiconductor markets, today announced it has entered a joint development
program (JDP) with CEA/Leti -- one of Europe's renowned research labs focusing
on microelectronics and nanotechnology. EVG, an early leader in through-silicon-via
(TSV) and 3D integration technology, will provide CEA/Leti with its world-class,
300-mm temporary bonding and debonding technology. The first system will be
shipped in May. The joint development work will focus on further developing
these technologies and processes to accelerate continued adoption of TSV technology
-- given its demonstrated advantages, which include higher performance, increased
functionality, smaller footprint and lower power consumption.
More functionality, lower power
Flash memory and image sensors continue to lead the charge implementing 3D IC/TSV
technology due to the complexity of the device structure and demands for more
functionality with lower power. In demonstrating a cost-effective, manufacturable
stackable interconnection technology, experts project TSV adoption to grow intensively
over the next few years expanding into various other advanced IC applications.
This joint development program spearheads another critical step to readying
integrated device manufacturers and foundries to fully implement 3D integration
technology and processes into their production lines, and bringing this technology's
advantages to a global commercial scale.
"We are extremely pleased to be working with EVG--not only for their proven
bonding/debonding and thin-wafer handling technology systems, but also for the
tremendous groundwork and expertise on tools for TSV technology and 3D integration
they bring to the table, which complements our own know-how in this field,"
said Nicolas Sillon, the head of the laboratory for advanced packaging and 3D
integration at Leti. "TSV and 3D integration is proving to be a viable
solution to a critical roadblock in advanced device performance. Together we
can continue to unlock the full potential of this technology to ensure widespread
commercialization for high-volume applications."
Commenting on today's announcement, Stefan Pargfrieder, EVG's business development
manager noted, "CEA/Leti is a world leader in accelerating emerging technologies
to widespread market adoption. We are thrilled to be working with such a prestigious
institution, and believe their expertise will be crucial to this JDP and pushing
TSV and 3D technology forward in the market place. We are seeing an increasing
number of high-volume manufacturers exploring implementation of this technology
in their production lines, and this joint effort with CEA/Leti will be instrumental
in continuing this positive momentum."
This cooperation also strengthens the existing and established joint development
activities between Brewer Science, EVG and Leti. Ultimately, it exemplifies
the synergy between materials, equipment and process expertise, and further
enables value-added products and know-how in the growing field of 3D IC/TSV
technology, as well as other potential users of temporary bonding and debonding
CEA/Leti and EV Group have already commenced work on the project and have
produced successful results in 3D applications using their TSV technology and