SEMATECH, a global
consortium of chip-makers, and NEXX Systems, Inc., a leading provider of process
equipment for advanced wafer-level packaging applications, today announced that
NEXX Systems has become a member of SEMATECH's 3D Interconnect Program located
at the College of Nanoscale Science and Engineering (CNSE) of the University
As a member of SEMATECH's 3D program, NEXX will collaborate with SEMATECH
in leading-edge research on innovative electrodeposition technology and the
development of high yield, low cost copper electroplating solutions that will
enable high density 3D through-silicon-vias (TSVs).
Dr. Tom Walsh, NEXX Systems, President and CEO, "We are excited to be
part of the SEMATECH 3D Interconnect program, working with the most advanced
300 mm equipment and technologists in developing this leading-edge technology.
Our Stratus electrodeposition platform is uniquely suited to achieve significant
improvements in both the reliability and cost-effectiveness of 3D devices, aiding
their rapid adoption into mainstream electronics."
"We all recognize that collaboration among various disciplines across
the industry will be required to realize the full potential of 3D. Launched
two years ago, the 3D program has been actively engaging with leading edge equipment
and materials suppliers and leveraging their expertise to deliver manufacturable
process solutions," said John Warlaumont, SEMATECH vice president of advanced
technology. "NEXX's membership is the latest example of this new collaborative
model that encourages participation with SEMATECH members in focused, cooperative
Richard Brilla, vice president for strategy, alliances and consortia at CNSE,
said, "We are delighted to welcome NEXX Systems to the UAlbany NanoCollege,
where it joins a host of the world's leading high-tech companies engaged in
next-generation nanoelectronics research and development. This new partnership
is further evidence that SEMATECH's expansion at CNSE is paying significant
dividends, not only in world-class education and cutting-edge research, but
also in economic outreach and growth."
"NEXX is well known for its innovation and expertise in the area of advanced
wafer-level packaging items, and their participation in SEMATECH's 3D program
will be very valuable," said Sitaram Arkalgud, SEMATECH's 3D program director.
"Our mission is to make 3D-TSV both manufacturable and cost effective,
and we look forward to working with NEXX to deliver processes that will accelerate
progress toward industry-wide implementation."
The goal of SEMATECH's 3D IC program at the UAlbany NanoCollege is to ready
TSV technology by addressing the infrastructure and development challenges in
3D-TSV, including materials characterization, unit processes and integration,
equipment hardening, reliability, cost and benefit to device and circuit performance.
Eventually, 3D interconnects will provide cost-effective ways to integrate diverse
CMOS technologies and chips with emerging technologies such as micro- and nano-
electromechanical systems (MEMS, NEMS) and bio-chips.