Camtek Ltd., today announced that it has entered into a frame engagement for 10 semiconductor inspection systems with an Asian OSAT (outsourced semiconductor assembly and test) company. The first systems’ order, in excess of $2 million, will be installed during the second and third quarters, with expectations for additional systems' orders over the next few quarters.
Camtek's line of automated wafer inspection systems enables semiconductor manufacturers, bumping houses and packaging foundries, to monitor processes and enhance yield by detecting defects. Camtek's systems deliver unparalleled 2D and 3D inspection and metrology capabilities for wafers, both before or after test, along the bumping process or after dicing, and address the specialized needs of the most advanced applications.
Roy Porat, Camtek’s Chief Executive Officer, commented, “I am pleased with this order win. Such a significant order provides us with improved visibility and strengthens our market share at outsourced semiconductor assembly and test providers, companies which play an ever evolving and increasingly important role in the semiconductor packaging ecosystem.”
ABOUT CAMTEK LTD.
Camtek Ltd. provides automated and technologically advanced solutions dedicated to enhancing production processes and increasing yields, enabling and supporting customer’s latest technologies in the Semiconductors, Printed Circuit Boards (PCB) and IC Substrates industries.
Camtek addresses the specific needs of these interconnected industries with dedicated solutions based on a wide and advanced platform of technologies including intelligent imaging, image processing, adaptive ion milling (AIM) and digital material deposition (DMD). Camtek's solutions range from micro-to-nano by applying its technologies to the industries' specific requirements.