The L400 UHV magnetron sputtering system is designed for sequential sputtering with movable magnetrons. Conventional sequential sputtering systems with rotating planetary substrate stage provide limited substrate manipulation facilities. In the L400 design the substrate stage is stationary and the magnetrons are moved in sequence of the deposited multilayer. This allows the use of substrate masking with movable shutters, RF and DC substrate bias, wedge deposition and azimuthal substrate rotation - features not available in any other sputtering system.