The nanoLED SEM image (pictured) by Eindhoven University of Technology (TU/e) recently won a competition held by Oxford Instruments Plasma Technology, and chosen from a large number of entries, all demonstrating unique and intriguing process results obtained using Oxford Instruments equipment.
Submitted by PhD Candidate Victor Dolores-Calzadilla from the Photonic Integration Group at TU/e, the SEM image titled “Integrated nanoLED for photonic circuits” was achieved using a combination of three Oxford Instruments plasma processing tools.
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The SEM image clearly demonstrates the cutting edge plasma etch and deposition technology that Oxford Instruments Plasma Technology’s systems offer the LED fabrication market.
Dolores-Calzadilla states:
“We’re currently researching metal-cavity nanolasers and nanoLEDs using Oxford Instruments systems for their fabrication. This nanoLED is just one example of the excellent results we are achieving using a combination of Oxford Instruments Plasmalab®100 RIE, ICP and PECVD tools. I am thrilled with our results and am happy to demonstrate the capabilities of the Photonic Integration Group at TU/e.”
Dr David Haynes, Sales, Marketing & CS Director at Oxford Instruments Plasma Technology comments:
“We are delighted to showcase the work of our customers, and to view the intricate processes produced with our systems. This competition was a fantastic insight into the multiple uses of our technology, and we were pleased to receive so many diverse entries.”
Victor Dolores-Calzadilla won £150 in Amazon vouchers for his entry.
Full information on how the nanoLED SEM was created can be found on the Oxford Instruments website:
www.oxford-instruments.com/SEM-2015
About Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for the etching of nanometre sized features, nanolayer deposition and the controlled growth of nanostructures.
These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition, deep silicon etch and physical vapour deposition. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette-to-cassette platforms for high-throughput production processing.