A study published this week in Proceedings of the National Academy of Sciences reports a new parallel-computing approach based on a combination of nanotechnology and biology that can solve combinatorial problems. The approach is scalable, error-tolerant, energy-efficient, and can be implemented with existing technologies. The pioneering achievement was developed by researchers from the Technische Universität Dresden and the Max Planck Institute of Molecular Cell Biology and Genetics, Dresden in collaboration with international partners from Canada, England, Sweden, the US, and the Netherlands.
Toppan Printing Co., Ltd. (hereafter Toppan Printing; head office: Chiyoda Ward, Tokyo; President & Representative Director: Shingo Kaneko) has developed a next-generation EUV photomask for leading-edge semiconductors.
The 2D materials workshop, on Thursday April 7th 2016, is going to take place at the National Graphene Institute (NGI) of Manchester University.
Dynavac, a leader in the manufacturer of thin film deposition systems, is pleased to announce that it has entered into an exclusive supply agreement with Winona PVD Coatings, LLC of Warsaw, Indiana, to produce Inline Production Systems to support growing demand for its G-Chrome deposition process.
Veeco Instruments Inc. announced today the launch of the new TurboDisc® K475i™ Arsenic Phosphide (As/P) Metal Organic Chemical Vapor Deposition (MOCVD) System for the production of red, orange, yellow (R/O/Y) light emitting diodes (LEDs), as well as multi-junction III-V solar cells, laser diodes and transistors.
Nanoscientists at the Univeristy of Alicante have modified a commonly-used compound, titanium dioxide, turning it from white to black to boost its efficiency. And they have done so in a way that improves on existing methods, making environmental applications a real possibility.
Heterostructures formed by different three-dimensional semiconductors form the foundation for modern electronic and photonic devices. Now, University of Washington scientists have successfully combined two different ultrathin semiconductors — each just one layer of atoms thick and roughly 100,000 times thinner than a human hair — to make a new two-dimensional heterostructure with potential uses in clean energy and optically-active electronics. The team, led by Boeing Distinguished Associate Professor Xiaodong Xu, announced its findings in a paper published Feb. 12 in the journal Science.
Researchers at the Paul Scherrer Institute have produced large numbers of detailed models of the Matterhorn, each one less than a tenth of a millimetre in size. With this, they demonstrated how 3-D objects so delicate could be mass-produced. Materials whose surface is covered with a pattern of such tiny 3-D structures often have special properties. What nature has exploited for so long could be instructive for a number of industrial applications. Many snakes glide over sand aided by 3-D structures on their skin that significantly reduce friction. Along the same lines, machine parts could be furnished with a comparable structure, thereby minimizing wear and tear.
After more than half a decade of speculation, fabrication, modeling and testing, an international team of researchers led by Drexel University’s Yury Gogotsi, PhD , and Patrice Simon, PhD, of Paul Sabatier University in Toulouse, France, have confirmed that their process for making carbon films and micro-supercapacitors will allow microchips and their power sources to become one and the same.
Have you ever noticed that when heated a film of oil in a pan doesn’t remain completely flat? Instead, it forms a wavy pattern that resembles the exterior of an orange. These sorts of deformations inspired a group of researchers at the Technical University of Darmstadt, in Germany, to explore whether they could be used to improve and streamline microfabrication processes.
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