Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced a purchase order from a leading IC manufacturer for a custom FOX Multi-Wafer Test System WaferPakTM Contactor and evaluation activities that will enable the manufacturer to qualify Aehr Test's next-generation FOX-XP multi-wafer system and FOX WaferPakTM Contactor for production test and burn-in of its devices.
Researchers belonging to the University of Pennsylvania, the University of Illinois at Urbana-Champaign and University of California, Berkeley have demonstrated a new method for changing the quantity of electrons that exist in a particular region within a graphene piece. Using graphene, the team has provided a proof-of-principle for producing the basic building blocks of semiconductor devices.
With its high electrical conductivity and optical transparency, indium tin oxide is one of the most widely used materials for touchscreens, plasma displays, and flexible electronics. But its rapidly escalating price has forced the electronics industry to search for other alternatives.
Michael Liehr, Executive Vice President of Innovation and Technology at the State University of New York (SUNY) Polytechnic Institute, will give a talk at 10 a.m. Friday, Jan. 30, in Room 1065 of Kemper Hall on the UC Davis campus. The event is hosted by S.J. Ben Yoo, a professor in the UC Davis Department of Electrical and Computer Engineering. The talk is presented as part of the College of Engineering’s Distinguished Lecture Series.
Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have conducted a study on active electrical control of energy flow from erbium ions into plasmons and photons.
Cypress Semiconductor Corp., a leading provider of embedded nonvolatile memory solutions, and United Microelectronics Corporation, a leading global semiconductor foundry, today announced that UMC licensed Cypress's SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP) for the 40-nanometer process technology node.
Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that United Microelectronics Corporation, a leading global semiconductor foundry, used Cadence® implementation and signoff tools to produce a silicon-ready 28nm ARM® Cortex®-A7 MPCore-based system on chip (SoC) targeting entry-level smartphones, tablets, high-end wearables and other advanced mobile devices.
Researchers at the University of Copenhagen have developed a new type of superconducting ‘nanowire’ crystal that holds great promise for future semiconducting electronics. These crystals, on the atomic scale, fuse metallic and semiconducting materials.
Global Unichip Corp. (GUC), the Flexible ASIC Leader™, and Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced they are collaborating to enable the development of high-performance networking solutions that will be manufactured using TSMC's 16-nm FinFET+ process technology.
As he continues to carry out scientific research at the molecular level - holding out the prospect of nano-scale electronics that offer massive increases in processing power - the University of Huddersfield's Dr Nathan Patmore is moving directly from one major award to a prestigious new source of funding.
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