Cascade Microtech, specializing in accurate wafer-level measurements, has released the first in their Viper probe cards product line. The cards will help in the testing of large quantities of wafer-level chip-scale packaged solutions (WLCSP).
The innovative probe pin used in the card is incorporated into the company’s patented laminated packaging technology to provide reliable electrical results to enhance manufacturing outputs and minimize proprietary costs.
Combination chips used in smart phones enable Bluetooth, near-field communication, WLAN, and digital TV capability. They use nanoscale and WLCSP packaging, which calls for high-performance known-good-die (KGD) analysis. WLCSP represents over 6% of IC packages globally, and is estimated to touch 15-20% over the coming 10 years.. Most of the packaging applications in the WLCSP market includes analog, optical, and RF wafer-level devices.
The Viper probe card is a multi-locational solution allowing scalability from x1 to x8 for individual dies without needing to alter the probe card design. The design ensures pin retention, enhanced tip position precision for steady contact resistance and low inductance ensuring expected results and better profits. The non-rotating pin is patented and minimizes PCB pad damage and enhances the life span of the probe card. Contact engines can be easily replaced without calling for extra equipment or microscopes on a per-DUT basis, which ensures decreased downtimes. The probe head can be provided with an Accel alternative, which enables single die testing, curtailing, test program enhancement and allowing repeat test of each die.