ASML’s division, Brion Technologies has introduced a novel product called Tachyon flexible mask optimization (Tachyon FMO) for semiconductor manufacturers.
Tachyon FMO is part of the Holistic Lithography portfolio of ASML. It facilitates the flawless utilization of several optical proximity correction (OPC) techniques in an individual mask tapeout. The utilization of multiple OPC techniques customized to localized imaging challenges reduce tapeout cycle time by one third, while delivering the same preferred imaging performance level when compared to competitive technologies.
Tachyon FMO is especially suitable for 2x nm designs that need highly sophisticated scanner capabilities such as ASML’s FlexWave customized wavefronts and FlexRay illuminator as well as advanced OPC techniques to attain pattern fidelity in lithography.
Techniques, including 3D mask modeling and model based sub-resolution assist features, are vital to good imaging but can be computationally powerful and can add cost and complexity to mask production. Tachyon FMO offers a strong profit on investment by reaching the preferred imaging performance, while decreasing mask complexity and improving throughput at lower or same cost.
Superior quality boundary healing between various correction areas is the key to Tachyon FMO that allows the utilization of several mask correction techniques. Brion Technologies has designed a novel solution capable of detecting and manipulating trouble-areas or hotspots and reinserting the corrected hotspots perfectly into the complete chip design without inducing new defects caused by proximity effects of adjacent patterns.
According to Jim Koonmen Brion Technologies’ General Manager, the company is happy about the use cases and novel applications of defect-free boundary healing of its Tachyon FMO. The mask correction capability at 2x nm and below addresses some highly important computational challenges of its customers, while helping them achieve their preferred cost targets and imaging.
Source: http://www.asml.com