Nanofabrication News

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New Approach Paves Way to Large-Scale Manufacturing of Graphene-Based Devices

A new way of growing graphene without the defects that weaken it and prevent electrons from flowing freely within it could open the way to large-scale manufacturing of graphene-based devices with applications in fields such as electronics, energy, and healthcare.

2 Feb 2013

New Particle Assembly Technique Holds Potential to Improve Design of Industrial Products

New York University physicists have developed a method for moving microscopic particles with the flick of a light switch. Their work, reported in the journal Science, relies on a blue light to prompt colloids to move and then assemble—much like birds flock and move together in flight.

2 Feb 2013

Texas A&M University Researchers Build Completely Organic Nanobrick Wall

Researchers at Texas A&M University have for the first time made a completely organic nanobrick wall that does not allow gas to pass through it.

1 Feb 2013

Tighter Collaboration Needed Between Nanometer-Node Process Developers and Wafer Fab Managers

The rapidly growing application of SlurryScope™ systems at major semiconductor wafer fabs has begun to stimulate the need for tighter collaboration between nanometer-node process developers and the wafer fab managers who oversee the quality/delivery of slurry used during chemical-mechanical planarization (CMP) process. Minimizing large particle counts (LPCs) in undiluted slurry at wafer planarization and polishing steps is becoming increasingly critical as complex chips are manufactured at ever finer geometries.

31 Jan 2013

Kilopass Completes JEDEC 3-Lot Qualification for SMIC LL CMOS Process Technologies

Kilopass Technology, Inc., the leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), and Semiconductor Manufacturing International Corporation (NYSE: SMI) (SEHK: 981), a leading IC foundry, today announced that Kilopass IP has successfully completed the JEDEC 3-lot qualification for the SMIC 65nm, 55nm and 40nm low-leakage (LL) CMOS process technologies.

31 Jan 2013

TSMC OIP Forum 2012 Honors Berkeley Design Automation and Silicon Creations with Customers’ Choice Award

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that its joint paper with Silicon Creations, “Silicon-Accurate Mixed-Signal Fractional-N PLL IP Design,” presented at TSMC’s 2012 Open Innovation Platform® (OIP) Ecosystem Forum has received the TSMC OIP Forum 2012 Customers’ Choice Award.

30 Jan 2013

STATS ChipPAC and UMC Demonstrate TSV-Enabled 3D IC Chip Stacking Technology

STATS ChipPAC Ltd., a leading semiconductor advanced packaging and test service provider, and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.

From United Microelectronics Corporation 30 Jan 2013

memsstar Receives Two Strategic Etch System Orders from Asia

memsstar Limited, a leading provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced two strategic etch system order wins from new MEMS customers in Asia. memsstar recently shipped its memsstar® R&D system to manufacturing customers in Korea and India for use in MEMS research and development, representing the first memsstar etch release system orders from these countries.

From memsstar Ltd. 30 Jan 2013

MEMC’s One Millionth Silvantis Solar Module Produced at Flextronics Facility

MEMC Singapore Pte. Ltd., a wholly owned subsidiary of MEMC Electronic Materials, Inc., and Flextronics, today celebrated the production of the one millionth MEMC Silvantis™ solar module at the Flextronics facility in Port of Tanjung Pelepas (PTP), Johor, Malaysia.

From GlobalWafers Co., Ltd. 30 Jan 2013

Axcelis to Display Latest Advancements in Ion Implantation at SEMICON Korea 2013

Axcelis Technologies, Inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it will showcase its latest advancements in ion implantation at SEMICON Korea 2013.

29 Jan 2013