Nanofabrication News

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Dense ULK and Diffusion Barrier Stack Absorbs Order-of-Magnitude More UV Radiation Than Porous Interconnect Alternatives

In order for RC delay to continue to scale in accordance with the International Technology Roadmap for Semiconductors (ITRS), device manufacturers are integrating ultra-low k (ULK) dielectric materials into their 32 nm process flows.

6 May 2009

AIXTRON Receives Order for Two New MOCVD Systems from China's CIOMP

AIXTRON AG today announced that CIOMP, the Changchun Institute of Optics, Fine Mechanics + Physics, based in P.R. China, has ordered two new MOCVD systems: one AIX 200/4 and one AIX 200/4 RF-S.

From AIXTRON SE 5 May 2009

More Advanced Technologies are Less Efficient in Their Use of Energy and Materials per Kilogram of Output

A comprehensive study of old and new manufacturing processes, from machining metal to making carbon nanofibers, shows that the more advanced technologies are less efficient in their use of energy and materials per kilogram of output.

4 May 2009

Research Team Examines the Applications of Graphene

This nanoscopic material called graphene, first generally acknowledged to exist just five years ago, turns out to have a variety of unique, and potentially very useful, characteristics.

4 May 2009

Agreement Focused on sp3's CVD Diamond Products for Thermal Management Applications

sp3 Diamond Technologies, Inc. (sp3), a leading supplier of diamond film products, equipment and services, today announced that Adams Technical Sales (ATS) has been engaged as a sales representative, and will be responsible for increasing sales of sp3's chemical vapor deposition (CVD) diamond products for thermal management applications.

30 Apr 2009

Collaboration Between AIXTRON and Semileds Resulted in Successful Fabrication of GaN-Based Blue LED Chips on 6-inch Sapphire Wafers

A collaboration between AIXTRON and Semileds has resulted in the successful fabrication of GaN-based blue LED chips on 6-inch sapphire wafers. Not only were optical results encouraging but also the process is sufficientl...

From AIXTRON SE 30 Apr 2009

First Nano and Channel Partner to Participate in the 2009 NSTI Nanotech

First Nano, a division of CVD Equipment Corporation (NASDAQ: CVV), and channel partner Airgas, will be participating in the 2009 NSTI Nanotech Expo to be held in Houston, TX from May 5-6 at the George R. Brown Convention...

From CVD Equipment Corporation 28 Apr 2009

SAFC Hitech Underlined its Commitment to Japan's Microelectronics Industry

SAFC Hitech®, a business segment within SAFC®, a member of the Sigma-Aldrich® Group (NASDAQ: SIAL), today underlined its commitment to Japan's microelectronics industry by announcing it has extended its collaborative partnership with leading industrial and medical gas producer, Air Water Inc., (AWI).

28 Apr 2009

Taiwanese Foundry Selects ASM's Pulsar ALD Tool for Volume Manufacturing of 28 nm Node High-K Gate Dielectric Process

ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM), announced that a Taiwanese foundry has selected ASM's Pulsar® atomic layer deposition (ALD) tool for the volume manufacturing of its ...

28 Apr 2009

Veeco's New FastLine Platform Designed for Low Cost of Ownership Production of CIGS Solar Cells

Veeco Instruments Inc. (Nasdaq: VECO), announced the introduction of its FastLine™ platform of Glass Coating Systems, leveraging Veeco's proven PV-Series™ Thermal Deposition Sources.

From Veeco 27 Apr 2009

Nanofabrication News

Dense ULK and Diffusion Barrier Stack Absorbs Order-of-Magnitude More UV Radiation Than Porous Interconnect Alternatives

AIXTRON Receives Order for Two New MOCVD Systems from China's CIOMP

More Advanced Technologies are Less Efficient in Their Use of Energy and Materials per Kilogram of Output

Research Team Examines the Applications of Graphene

Agreement Focused on sp3's CVD Diamond Products for Thermal Management Applications

Collaboration Between AIXTRON and Semileds Resulted in Successful Fabrication of GaN-Based Blue LED Chips on 6-inch Sapphire Wafers

First Nano and Channel Partner to Participate in the 2009 NSTI Nanotech

SAFC Hitech Underlined its Commitment to Japan's Microelectronics Industry

Taiwanese Foundry Selects ASM's Pulsar ALD Tool for Volume Manufacturing of 28 nm Node High-K Gate Dielectric Process

Veeco's New FastLine Platform Designed for Low Cost of Ownership Production of CIGS Solar Cells

Novel Semiconductor Born from Graphene and Glass

3D SiOx-Embedded Porous Carbon Nanofiber Hosts for Dendrite-Free Lithium Batteries

Novel Liquid Crystal Process Unlocks High-Purity Carbon Nanotubes for Motor Applications

Rapid Biomimetic Nanovaccine for Personalized Cancer Therapy

Biodegradable Polymers for Targeted Body Heating

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

Breaking Barriers in Thin-Film Deposition with ATLANT 3D’s DALP Technology

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Atomic Force Microscopy Analysis of Polymer Stiffness Under Thermal Stress

Different DLS-Based Systems Can Give Us Different Size Results, and All of Them Can Be correct!

Next Generation Magnetic Force Microscopy with PeakForce Probes

Unlocking Material Behavior at the Microscale Using Nanoindentation