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AIXTRON Announces Agreement to Cooperate on Qualification of Atomic Vapor Deposition Technology

AIXTRON AG (FWB:AIXA) (NASDAQ:AIXG) and Ovonyx, Inc. today announced an agreement to cooperate on the qualification of Atomic Vapor Deposition (AVD®) process technology to further advance scaling of next-generation p...

From AIXTRON SE 20 Jan 2009

IVAM Product Market "Micro, Nano + Materials" Highlights Latest Trends and Applications

New trends and applications from various high-tech areas will be presented again this year by the exhibitors of the Product Market "Micro, Nano + Materials" at MicroTechnology/HANNOVER MESSE from April 20 to 24, 2009 in Hanover, Germany.

19 Jan 2009

SMI Opens Application Lab Facilities for MOCVD Growth of ZnO Based Films

Structured Materials Industries, Inc. (SMI) announces today that it has opened its application lab facilities for the MOCVD growth of ZnO based films for transparent contact work as used with LEDs and photovoltaics, as well as ZnO films for transparent and power transistors.

18 Jan 2009

Handheld Device Recognizes Wide Variety of Environmental or Medical Compounds

A handheld, ultra-portable device that can recognize and immediately report on a wide variety of environmental or medical compounds may eventually be possible, using a method that incorporates a mixture of biologically tagged nanowires onto integrated circuit chips, according to Penn State researchers.

15 Jan 2009

Tegal Receives Order for Endeavor AT PVD Cluster Tool Upgrade from Major Power Management Components Maker

Tegal Corporation, a leading designer and manufacturer of plasma etch and deposition systems used in the production of power semiconductor, MEMS, and optoelectronic devices, announced today that the Company received an o...

From Collabrx, Inc. 15 Jan 2009

Inexpensive Process that Gets Nanotubes to Obediently Line Themselves Up

A new study* from the National Institute of Standards and Technology (NIST) and Rice University, however, offers an inexpensive process that gets nanotubes to obediently line themselves up-that is, self-assemble-in neat rows, more like ducks.

13 Jan 2009

IMEC Announces Collaboration with Replisaurus on 3D Integration Research

S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announc...

From IMEC 13 Jan 2009

CVD Equipment Corporation Announces Orders in 2008 Reached $29.0 Million

CVD Equipment Corporation (Nasdaq: CVV) announced that 2008 order levels reached $29.0 million, more than double the 2007 order levels of $14.4 million, an increase of 101%. Approximately half of the orders in 2008 were ...

From CVD Equipment Corporation 12 Jan 2009

Milestone Towards Fabricating Low-Cost GaN Power Devices

IMEC, Europe's leading independent research center in the field of nanoelectronics, and AIXTRON, the world leader in metal-organic chemical-vapor deposition (MOCVD) equipment, have demonstrated the growth of high-qua...

8 Jan 2009

Localized Support to Address Increased Demand for 3D IC Process Development

EV Group (EVG) and Brewer Science, Inc., today announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offe...

7 Jan 2009