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Nano Dimension CEO to Present on 3D Printing for Professional Industries at The Israel Conference

Nano Dimension Ltd., a leading printing electronics company in the area of 3D printing, announced today that Amit Dror, CEO of Nano Dimension, will participate at The Israel Conference™. Mr. Dror will present a "Fast & Cool" session on 3D printing for professional industries. He will provide an overview of Nano Dimension, discuss management's experience in leading a public company and highlight the company's achievements to-date as well as its innovative approach in the space of 3D electronics printing.

15 Oct 2015

Leading Semiconductor Manufacturer Places Order for Ultratech’s Advanced Packaging AP300 Lithography Systems

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received a large multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems.

15 Oct 2015

Researchers Synthesize New Nanohoops Using Non-Carbon Atoms

Heteroatomic nanohoops, structures previously only made with carbon atoms, have been produced. The introduction of different atoms can be used to tune the nanostructure's photoelectronic properties.

13 Oct 2015

Cadence Introduces Memory Model for LPDDR5 Standard

Cadence Design Systems, Inc., today announced the Cadence® Memory Model for the LPDDR5 standard. This new verification IP (VIP) product enables engineers to verify that system-on-chip (SoC) designs are compliant with the JEDEC interface standard, and that they can operate correctly in a system with the actual memory components. Validation of designs using the LPDDR5 memory model reduces the risk of mistakes, rework and delayed production, leading to faster production ramp-up and higher product quality.

From Cadence Design Systems 13 Oct 2015

Spectronics Introduces Advanced PC-10020-LT UV EPROM/Wafer Erasing System

Whether a technician is erasing one EPROM chip or many, Spectronics Corporation manufactures the latest, most advanced, reliable UV EPROM erasing equipment in the world.

9 Oct 2015

1366 Technologies to Build Commercial Solar Direct Wafer Manufacturing Facility in Genesee County New York

1366 Technologies today announced plans to build a state-of-the-art, commercial solar wafer manufacturing facility in Genesee County New York, strategically located between Buffalo and Rochester, that will eventually scale to 3 GW, house 400 Direct Wafer™ furnaces, and produce more than 600 million high-performance silicon wafers per year – enough to power 360,000 American homes.

8 Oct 2015

3M Licenses Lotus’s TransFlexALD Spatial Atomic Layer Deposition Technology

3M has entered into a licensing agreement with Lotus Applied Technology to access Lotus’s TransFlexALDTM spatial Atomic Layer Deposition (ALD) and barrier materials patent portfolio.

8 Oct 2015

Aehr Test Systems Receives First Order for New FOX-XP Test and Burn-In System

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced the company has received its first order for its FOX-XP Wafer Level Test and Burn-in System including multiple FOX-XP WaferPak Contactors and application development services.

8 Oct 2015

Cadence and imec Complete First Tapeout of 5nm Test Chip using EUV and 193i Lithography

Nano-electronics research center imec and Cadence Design Systems, Inc. today announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as well as 193 immersion (193i) lithography.

8 Oct 2015

Nanophase Awarded U.S. Patent for C3 Metal Oxide Surface Treatment Technology

Nanophase Technologies Corporation announced today that it has been granted U.S. patent 9,139,737 for its C3 metal oxide surface treatment technology. Patents in other countries are pending.

8 Oct 2015