Nanofabrication News

RSS

Xiamen Changelight Switches to Veeco’s GaN MOCVD Systems

Veeco Instruments Inc. announced today that Xiamen Changelight Co., Ltd. (Changelight) has selected the Company as its primary equipment provider as it enters the market to produce gallium nitride (GaN) based blue/green high brightness light emitting diodes (LEDs) for display and general lighting applications.

From Veeco 31 Jul 2014

Material Surface Structure Designed at the Nanoscopic Level Can Make it Appear in Different Colors

Long before humans figured out how to create colors, nature had already perfected the process — think stunning, bright butterfly wings of many different hues, for example. Now scientists are tapping into those secrets to develop a more environmentally friendly way to make colored plastics. Their paper on using structure — or the shapes and architectures of materials — rather than dyes, to produce color appears in the ACS journal Nano Letters.

From American Chemical Society 31 Jul 2014

NSF Awards $330,000 Grant to Investigate Nanorod and Nanowire Synthesis Using Nanoparticle Seeds

A professor from Wayne State University’s College of Engineering recently received a $330,000 award from the National Science Foundation for the project, “Nanoparticle-directed synthesis of organic nanorods.”

31 Jul 2014

Mechanical Forces Direct Nanostructures to Form Complex 3D Microstructures

A team of researchers has created a new way of manufacturing microstructured surfaces that have novel three-dimensional textures. These surfaces, made by self-assembly of carbon nanotubes, could exhibit a variety of useful properties — including controllable mechanical stiffness and strength, or the ability to repel water in a certain direction.

From Massachusetts Institute of Technology 30 Jul 2014

Graphene Oxide Sheets Self-Assemble to Form Nanoengineered Foam

Tough, ultralight foam of atom-thick sheets can be made to any size and shape through a chemical process invented at Rice University.

30 Jul 2014

Encapsulated Wafer Level Chip Scale Package Solution Provides Quality Benefits

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, today announced new quality benefits for fan-in wafer level packaging made possible by its encapsulated Wafer Level Chip Scale Package (eWLCSP™) solution.

29 Jul 2014

Marcy Nanocenter Site Receives Wet Lands Permit from Army Corps of Engineers

Governor Andrew M. Cuomo today announced that the U.S. Army Corps of Engineers has issued a Section 404 permit for the Marcy Nanocenter site, enabling the next phase of the Nano Utica initiative. This includes the construction of a 450 MM enabled wafer fabrication campus and significant local job creation that will further solidify New York’s global position as a leader in semiconductor manufacturing and nanotechnology.

From College of Nanoscale Science and Engineering, University at Albany 25 Jul 2014

Simple, Cost-Effective Approach to Modify Properties and Functions of Nanomaterials

The challenges faced by researchers in modifying properties of nanomaterials for application in devices may be addressed by a simple technique, thanks to recent innovative studies conducted by scientists from the National University of Singapore (NUS).

23 Jul 2014

New Solution-Based Mineral Substitution Process for Making a Precursor to Transparent Thin Films

The yield so far is small, but chemists at the University of Oregon have developed a low-energy, solution-based mineral substitution process to make a precursor to transparent thin films that could find use in electronics and alternative energy devices.

22 Jul 2014