Nanofabrication News

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Leonard Castellano, Director of Applications Engineering at FibeRio Technology, to Present at the AFS Spring 2014 Conference on March 25th, 2014

FibeRio® Technology Corporation, the developer and manufacturer of ground breaking Forcespinning® nanofiber production systems, today announced that Leonard R. Castellano will be presenting “Polyester Nanof...

20 Mar 2014

New Report on Global e-Beam Wafer Inspection System Market

Research and Markets has announced the addition of the "Global e-Beam Wafer Inspection System Market, 2018: Market Shares & SWOT Analysis of Key Vendors" report to their offering.

From Research and Markets 20 Mar 2014

New, Next Generation Ultrasonic Generator from Sono-Tek

USA has introduced a new, next generation ultrasonic generator. The ECHO ultrasonic generator is designed for the highest degree of accuracy and control of ultrasonic spray processes using Sono-Tek ultrasonic nozzle technology.

14 Mar 2014

Comprehensive Analytics Report on Worldwide Markets for Nanocoatings

Research and Markets has announced the addition of the "Nanocoatings - Global Strategic Business Report" report to their offering.

From Research and Markets 14 Mar 2014

Mikron to Leverage Cadence EDA Tools for 90 nm IC Design Flow

Cadence Design Systems, Inc., a leader in global electronic design innovation, and JSC Mikron, the largest manufacturer and exporter of microelectronics and RFIDs in Russia and CIS (Community of Independent States), part of the industrial holding “RTI Systems”, announced today that Mikron has licensed Cadence® Physical Verification System (PVS) and Cadence QRC Extraction to be used in Mikron’s basic 90nm IC design flow.

From Cadence Design Systems 14 Mar 2014

Researchers Fabricate Thin Films of Spin Ice with Thicknesses of Only a Few Nanometres

Thin films of spin ice have been shown to demonstrate surprising properties which could help in the development of applications of magnetricity, the magnetic equivalent of electricity.

13 Mar 2014

Cadence, GLOBALFOUNDRIES Tape Out Quad Core Test Chip Built Around ARM Cortex-A12 Processor

Cadence Design Systems Inc. and GLOBALFOUNDRIES announced that they have taped out a quad core test chip built around the ARM Cortex-A12 processor. Targeted to operate at frequencies of up to 2.0GHz while still within the mainstream mobile power and area envelope, the test chip is implemented in GLOBALFOUNDRIES’ 28nm-SLP (Super Low Power 28 nanometer High-K Metal Gate) process using a full Cadence® tool flow and incorporates ARM POP™ technology to leverage the full performance range of the 28-SLP process.

From GlobalFoundries 13 Mar 2014

Broadcom Unveils BCM82322 Lite-PHY Fabricated in 28nm CMOS Technology

Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first triple speed 10/40/100G Lite physical layer transceiver (Lite-PHY) designed for high-density data center applications.

12 Mar 2014

FCI to Present on Dielectric Laser via Drilling for Next Generation Wafer Level Processing at IMAPS 2014

FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced they will give the following paper at the IMAPS – 10th International Conference and Exhibition on Device Packaging 2014 in Scottsdale Arizona, USA.

10 Mar 2014

Ultrathin Layers of Tungsten and Selenium Hold Promise for Solar Cells

Ultrathin layers made of Tungsten and Selenium have been created at the Vienna University of Technology; experiments show that they may be used as flexible, semi-transparent solar cells

10 Mar 2014