Nanoelectronics News

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Integrated Sensor System to Measure Power Output of Cycle Riders

CEA-Leti and CORIMA, a leading supplier of carbon-composite wheels and frames for track and road-racing cyclists, today announced they are developing an integrated sensor system to measure the power output of riders as they pedal.

28 Jun 2014

ElectroniqueS Magazine Honors Xilinx Virtex UltraScale Device with 2014 Electron d'Or Award

Xilinx, Inc. today announced that its Virtex® UltraScale™ device won the 2014 Electron d'Or Award for Best Programmable Logic Product. Presented by ElectroniqueS Magazine in Paris on June 18, the Virtex UltraScale VU440 device with record breaking 4.4M logic cells and advanced 3D IC technology was recognized by a panel of industry experts and editors of France's leading electronics publication.

27 Jun 2014

cfaed Recognized Among Top Places to Undertake Research in Micro- and Nanoelectronics

Two years after obtaining the status of Excellence, Technische Universität Dresden (TUD) strikes a positive balance: "The Center for Advancing Electronics Dresden (cfaed) strengthens the innovative location Dresden," TUD rector Prof. Hans Müller-Steinhagen said today about the Cluster of Excellence to journalists in Dresden.

27 Jun 2014

SEMICON West: QuantumClean to Present on ‘Importance of Precision Parts Cleaning for Sub-20nm Technology Nodes’

QuantumClean® and ChemTrace® today announced that they will be exhibiting at the SEMICON West tradeshow, held at the Moscone Center in San Francisco from July 8th through the 10th, 2014.

26 Jun 2014

New Report on Materials, Processes & Tools for Roll-to-Roll Fabrication of Flexible Devices & Electronics

Research and Markets has announced the addition of the "Materials, Processes & Tools for Roll-to-Roll Fabrication of Flexible Devices & Electronics" report to their offering.

From Research and Markets 25 Jun 2014

Synopsys Offers DesignWare IP for TSMC's 28-nm High-Performance Compact Process

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the immediate availability of a wide range of DesignWare interface, analog, logic library and embedded memory IP for TSMC's 28-nanometer (nm) high-performance compact (HPC) process.

From Synopsys, Inc. 25 Jun 2014

SPTS Enters Agreement with CEA-Leti to Develop 3D High Aspect Ratio Through-Silicon-Via Solutions

SPTS Technologies, a leading manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies The two-year agreement enters under the framework of the Nanoelec Research Technology Institute program which is led by CEA-Leti, and covers co-development of a range of deposition processes for next-generation 3D high aspect ratio through-silicon-via (TSV) solutions.

From CEA-Leti 25 Jun 2014

JUSUNG Provides Etcher and Single Type TSD-CVD Semiconductor Deposition Equipment to CNSE /SUNYIT

In accordance with Governor Andrew M. Cuomo’s commitment to maintaining New York State’s leadership in nanotechnology, the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) today announced a strategic partnership agreement with JUSUNG Engineering Co., Ltd. which includes delivery of state-of-the-art equipment for use in production processes of nanoscale computer chips and the location of technical staff from Korea to the Albany Nanotech campus.

From College of Nanoscale Science and Engineering, University at Albany 24 Jun 2014

EPFL Invited to Participate in EU Graphene Flagship Research Initiative

Four EPFL professors have been invited to participate in the Graphene Flagship. This research initiative has been selected by the EU at the same time as the EPFL-led Human Brain Project to receive significant financial support over the next ten years.

24 Jun 2014

DOE Awards $12 Million for ‘Spins and Heat in Nanoscale Electronic Systems’ Project

A UC Riverside-led research project is among the 32 named today by U.S. Energy Secretary Ernest Moniz as an Energy Frontier Research Centers (EFRCs), designed to accelerate the scientific breakthroughs needed to build a new 21st-century energy economy in the United States.

From University of California at Riverside 19 Jun 2014

Nanoelectronics News

Integrated Sensor System to Measure Power Output of Cycle Riders

ElectroniqueS Magazine Honors Xilinx Virtex UltraScale Device with 2014 Electron d'Or Award

cfaed Recognized Among Top Places to Undertake Research in Micro- and Nanoelectronics

SEMICON West: QuantumClean to Present on ‘Importance of Precision Parts Cleaning for Sub-20nm Technology Nodes’

New Report on Materials, Processes & Tools for Roll-to-Roll Fabrication of Flexible Devices & Electronics

Synopsys Offers DesignWare IP for TSMC's 28-nm High-Performance Compact Process

SPTS Enters Agreement with CEA-Leti to Develop 3D High Aspect Ratio Through-Silicon-Via Solutions

JUSUNG Provides Etcher and Single Type TSD-CVD Semiconductor Deposition Equipment to CNSE /SUNYIT

EPFL Invited to Participate in EU Graphene Flagship Research Initiative

DOE Awards $12 Million for ‘Spins and Heat in Nanoscale Electronic Systems’ Project

New Nanomaterial Offers Sustainable Drinking Water Solution

Electron-Phonon Interactions Boost 2D Semiconductor Conductivity

Carbon Nanofibers Boost Strength and Durability of Fiber Composites

Nano-Formulations Boost Plant Growth and Inhibit Nematode Production

Rapid Biomimetic Nanovaccine for Personalized Cancer Therapy

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

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