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MagnaChip Enters Into SOI RF CMOS Technology Transfer Agreement with National Nano Fab Center

MagnaChip Semiconductor Corporation ("MagnaChip"), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and the National Nano Fab Center ("NNFC") have entered into an SOI RF CMOS technology transfer agreement which combines MagnaChip's specialty manufacturing expertise with NNFC's robust RF technology.

23 Jul 2013

New Report on Barrier Films for Flexible Electronics

Research and Markets has announced the addition of the "Barrier Films for Flexible Electronics 2013-2023: Needs, Players, Opportunities" report to their offering.

From Research and Markets 20 Jul 2013

Rochester Kodak Building to be Transformed into CNSE PV Development Facility

Governor Andrew M. Cuomo today announced that SUNY’s College of Nanoscale Science and Engineering (CNSE) will revitalize a vacant Kodak cleanroom building in Rochester by transforming it into a first-of-its-kind CNSE Photovoltaic Manufacturing and Technology Development Facility (CNSE MDF) for crystalline silicon photovoltaics, part of a $100 million initiative that will attract solar energy jobs and companies to the Greater Rochester Area.

From College of Nanoscale Science and Engineering, University at Albany 19 Jul 2013

Complete 28-nanometer Data Converter IP Portfolio from Synopsys

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of its 28-nanometer (nm) data converter IP portfolio,which includes DesignWare® analog-to-digital converters (ADCs), digital-to-analog converters (DACs) and integrated PLLs.

From Synopsys, Inc. 19 Jul 2013

Cadence DFM Flows Adopted to Perform Electrical Variability Optimization for UMC 28nm Designs

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that after extensive benchmark testing, semiconductor foundry United Microelectronics Corporation (UMC) has adopted the Cadence® “in-design” and signoff design-for-manufacturing (DFM) flows to perform physical signoff and electrical variability optimization for 28nm designs.

From Cadence Design Systems 17 Jul 2013

e2v Introduces P2041 and P3041 Quad-Core Processors

e2v, a leading global provider of hi-rel semiconductor solutions, has announced the availability of their P2041 and P3041 processors. These are extended-reliability versions of Freescale's quad core QorIQ™ processors for power-sensitive and computation intensive applications for demanding environments such as aerospace and defence.

15 Jul 2013

ESA to Hold 9th Micro and Nano Technologies Round Table in EPFL's New Swiss Tech Convention Center

Micro and Nano Technologies (MNT) for space applications will be the theme of this important meeting. It will take place in the new Swiss Tech Convention Center on 10-13 June 2014 and will host members from national delegations, space agencies, space and MNT industries, research centrers and universities.

15 Jul 2013

Inorganic Flexible Thin Film Solar Cell Successfully Fabricated Using Solution Processes

Scientists of Natcore Technology Inc., in collaboration with researchers at Rice University have successfully fabricated the first inorganic flexible thin film solar cell by solution processes. The work was reported in a recent issue of the journal Physical Chemistry Chemical Physics published by the Royal Society of Chemistry, volume 15, pages 3930-3938.

12 Jul 2013

NanoKTN Organizes Nanotechnology and Manufacturing Exhibition in London

The Nanotechnology Knowledge Transfer Network, one of the UK’s primary knowledge-based networks for Micro and Nanotechnologies, is pleased to announce details of an exhibition it has organised at the Department of Business, Innovation and Skills (BIS) headquarters in London.

12 Jul 2013

Global 450 mm Consortium Selects Entegris Wafer Handling Products

Entegris, Inc. announced that its handling and shipping products for the safe, reliable transport and processing of 450 mm wafers were selected by the Global 450 mm Consortium (G450C), headquartered at SUNY’s College of Nanoscale Science and Engineering (CNSE) in Albany, New York, for use in the development of 450 mm wafer technology.

From Entegris 11 Jul 2013