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Major Foundry Acquires Mattson’s Helios XP Systems for 2Xnm Production

Mattson Technology Inc., a leading supplier of advanced process equipment used for the manufacture of semiconductors, today announced that it has shipped multiple systems of its Helios® XP rapid thermal processing (RTP) system for use in mass production at a major foundry. The systems will support the foundry's 2Xnm capacity ramp by offering leading temperature control for reliable device manufacturing coupled with a low cost of ownership (CoO).

21 Jun 2013

CNSE and Nuclea Partner to Develop Nanochips for Cancer Diagnosis and Treatment

Underscoring the strategic blueprint of Governor Andrew M. Cuomo in fueling New York’s growing reputation as a hub for nanotechnology-enabled innovation, SUNY’s College of Nanoscale Science and Engineering (CNSE) and Pittsfield, Massachusetts-based Nuclea Biotechnologies, Inc. (Nuclea) today announced the launch of a $1 million research partnership to enable the development and commercialization of a high-throughput nanochip to accelerate the diagnosis and treatment of breast, colon, prostate and other cancers.

From College of Nanoscale Science and Engineering, University at Albany 21 Jun 2013

CEA-Leti to Host Workshop on Future Technology Developments at SEMICON West 2013

CEA-Leti will host a workshop at SEMICON West 2013 on major technology developments in the next 10 years.

From CEA-Leti 20 Jun 2013

Researchers Demonstrate the Ability to 3D-Print Microbatteries

3D printing can now be used to print lithium-ion microbatteries the size of a grain of sand. The printed microbatteries could supply electricity to tiny devices in fields from medicine to communications, including many that have lingered on lab benches for lack of a battery small enough to fit the device, yet provide enough stored energy to power them.

19 Jun 2013

Camtek Receives Order for its Automated Wafer Inspection Systems

Camtek Ltd., today announced that it has entered into a frame engagement for 10 semiconductor inspection systems with an Asian OSAT (outsourced semiconductor assembly and test) company. The first systems’ order, in excess of $2 million, will be installed during the second and third quarters, with expectations for additional systems' orders over the next few quarters.

19 Jun 2013

Berkeley Design Automation’s Nanometer Circuit Verification Platform Selected by eMemory Technology

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that eMemory Technology, a leader in embedded non-volatile memory silicon IP, has selected the company’s Analog FastSPICE (AFS) Platform for block-level characterization, and full-circuit verification of its embedded non-volatile memory products for SoCs in wireless, consumer, industrial, and automotive applications.

19 Jun 2013

GLOBALFOUNDRIES’ 28nm HKMG Technology Helps Rockchip Ramp up Production of Mobile Processors

GLOBALFOUNDRIES and Fuzhou Rockchip Electronics Co., Ltd. today announced that Rockchip’s next-generation mobile processors are ramping to production on GLOBALFOUNDRIES’ 28nm High-K Metal Gate (HKMG) process technology.

From GlobalFoundries 18 Jun 2013

Nanotechnology Increases Demand for High-Precision Dimensional Metrology Equipment

Research and Markets has announced the addition of the "Analysis of the Global Dimensional Metrology Market in Electronic Manufacturing" report to their offering.

From Research and Markets 18 Jun 2013

X-FAB Enhances XP018 Process to Lower Chip Costs for Smart Analog Ics

X-FAB Silicon Foundries today announced it has enhanced the XP018 process with multiple options to lower chip costs for high-performance analog applications such as audio, sensor interface and 5V-environment power management applications. These options make the XP018 ideal for cost-sensitive consumer applications that require analog integration in 180nm technologies.

18 Jun 2013

UMC to Develop 10nm CMOS Process Technology with IBM Alliance

IBM and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.

From United Microelectronics Corporation 14 Jun 2013