Scientists from the University of Cambridge have created, for the first time, a new type of microchip which allows information to travel in three dimensions. Currently, microchips can only pass digital information in a very limited way - from either left to right or front to back. The research was published today, 31 January, in Nature.
Veeco Instruments Inc. announced today that Philips Innovation Services, a service provider within Royal Philips Electronics N.V., has recently qualified a NEXUS® Physical Vapor Deposition (PVD) System at its location on the High Tech Campus Eindhoven, Netherlands. This system will support Philips Innovation Services’ capabilities in a broad range of thin film device applications, including MEMS, sensors, nano-electronics and others.
Researchers at Rochester Institute of Technology, international semiconductor consortium SEMATECH and Texas State University have demonstrated that use of new methods and materials for building integrated circuits can reduce power—extending battery life to 10 times longer for mobile applications compared to conventional transistors.
Kilopass Technology, Inc., the leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), and Semiconductor Manufacturing International Corporation (NYSE: SMI) (SEHK: 981), a leading IC foundry, today announced that Kilopass IP has successfully completed the JEDEC 3-lot qualification for the SMIC 65nm, 55nm and 40nm low-leakage (LL) CMOS process technologies.
SEMI and the U.S. Photovoltaic Manufacturing Consortium (PVMC) today announced the signing of a Memorandum of Understanding (MOU) to enhance their cooperation in areas of standards and roadmap activities for the solar thin film industry.
SouthWest NanoTechnologies, Inc. (SWeNT®), the world leader in high quality, Single-Wall and Specialty Multi-Wall (SMW™) carbon nanotubes (CNT), will display its family of conductive and semi-conducting CNT inks for flexible printed electronics at the FlexTech Alliance 2013 Flexible Electronics and Displays Conference and Exhibition. SWeNT will be exhibiting in booth 48, Jan. 30th to Feb. 1st at the Phoenix Convention Center in Phoenix, AZ.
Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that its joint paper with Silicon Creations, “Silicon-Accurate Mixed-Signal Fractional-N PLL IP Design,” presented at TSMC’s 2012 Open Innovation Platform® (OIP) Ecosystem Forum has received the TSMC OIP Forum 2012 Customers’ Choice Award.
STATS ChipPAC Ltd., a leading semiconductor advanced packaging and test service provider, and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of its multiprotocol DesignWare® Enterprise 10G PHY IP to address the connectivity needs of a broad range of high-end, energy efficient networking and computing applications.
Nanoelectronics research centre imec and Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, announced today an extended collaboration agreement to accelerate scaling technologies for logic and memory devices. The first fabless integrated circuit company to become a core partner of imec, Qualcomm Technologies will gain comprehensive insight into all advanced process technologies under investigation at imec to help shape future product roadmaps.
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