Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that the company has been selected as one of Deloitte’s 2012 Technology Fast 500™ - a ranking of the 500 fastest growing technology, media, telecommunications, life sciences and clean technology companies in North America.
By fabricating graphene structures atop nanometer-scale “steps” etched into silicon carbide, researchers have for the first time created a substantial electronic bandgap in the material suitable for room-temperature electronics. Use of nanoscale topography to control the properties of graphene could facilitate fabrication of transistors and other devices, potentially opening the door for developing all-carbon integrated circuits.
In three studies published in the current issue of Technology and Innovation – Proceedings of the National Academy of Inventors®, innovators unveil creative technologies that could change our sources of energy, change our use of energy, and change our lives.
As design miniaturization evolves, mobile instruments, military, surveillance, and medical devices are being asked to go smaller and retain very high reliability. Miniature circuits and instruments are often highly portable and must fit into extremely tight spaces that require quick and easy cable connections in very rugged environments.
Researchers at the McCormick School of Engineering are part of a team that has used stretchable electronics to create a multipurpose medical catheter that can both monitor heart functions and perform corrections on heart tissue during surgery.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system at Texas State University.
The storage capacity of hard disk drives could increase by a factor of five thanks to processes developed by chemists and engineers at The University of Texas at Austin.
The heart of the computer industry is known as "Silicon Valley" for a reason. Integrated circuit computer chips have been made from silicon since computing's infancy in the 1960s. Now, thanks to a team of USC researchers, carbon nanotubes may emerge as a contender to silicon's throne.
Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced the availability of Analog FastSPICE™ AMS (AFS AMS) which delivers the industry’s simplest, fastest, most-accurate verification of today’s complex nanometer-scale mixed-signal circuits. AFS AMS combines the award winning, foundry certified Analog FastSPICE circuit simulator with any leading Verilog® hardware description language (HDL) simulator to provide full Verilog-AMS language support.
X-FAB Silicon Foundries today announced its XT018, the world’s first trench dielectric isolated SOI foundry technology offering for 200V MOS capability at 180nm. Using the full dielectric isolation of this modular process allows blocks at different voltage levels to be integrated on a single chip instead of placed on different chips. It significantly reduces the number of required additional components on printed circuit boards, eliminates latch-up and provides built-in robustness against electromagnetic interference.
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