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Genmark Introduces New Wafer Sorter

Genmark Automation Inc., a global leader in tool and factory automation solutions for the semiconductor manufacturing equipment industry, today announced the expansion of the SortMax wafer-sorter product line.

14 Jul 2010

Applied Materials to Showcase New Microchip Manufacturing Technologies

Applied Materials, Inc. will showcase its leadership and innovation for producing future generations of microchips and clean energy solutions at the Semicon West 2010, Intersolar North America and ASMC1 events in San Francisco this week.

From Applied Materials Inc. 14 Jul 2010

Availability of Soitec’s Fully Depleted Planar Technology on UTBOX Wafers

The Soitec Group, the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, thereby providing a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile consumer devices.

14 Jul 2010

NEXX’s Stratus Tool Enables 300mm Lead-Free Wafer Bumping

Technology leaders in the emerging lead-free bumping market are meeting “green” global policy requirements, such as ROHS, by using NEXX Systems’ Stratus plating tool to produce their system-in-package (SiP) and 3D wafer-level packaging (3D WLP) devices.

14 Jul 2010

New 9900 System for Dicing Ultra-Thin Wafers from ESI

Electro Scientific Industries, a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry, today unveiled its new 9900 system for ultra-thin wafer dicing.

From Electro Scientific Industries (ESI) 14 Jul 2010

Applied Materials to Service Equipment at NXP’s Wafer Facility in Holland

Applied Materials, Inc. today announced that it has signed a comprehensive, five-year contract to service all Applied Materials chip production equipment at NXP Semiconductor’s facility in Nijmegen, Holland.

From Applied Materials Inc. 14 Jul 2010

GSA Launches Awareness Campaign to Support European Semiconductor Industry

The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces it is launching an awareness campaign for Europe to encourage the EU Commission, regional governments, universities,...

14 Jul 2010

Increased Customer Acceptance of ASML's Holistic Lithography Solutions

ASML Holding NV (ASML) (NASDAQ:ASML) (Amsterdam:ASML) today at SEMICON West announces broad customer adoption of holistic lithography products which optimize semiconductor scanner performance and provide a faster st...

14 Jul 2010

Piezoelectric-Operated Actuators and Motors Estimated to Reach $12.3 Billion by 2014

A confluence of new piezo-based technology has breathed new capability into the nano- and micro-positioning world. Piezo actuation is increasingly suitable for applications formerly addressable only by magnetic motors, and the technology offers significant benefits in terms of size, speed, fieldlessness, reliability, vacuum compatibility, resolution and dynamics.

13 Jul 2010

Crossing Automation Receives Order for ExpressConnect Integrated Automation Platform

Crossing Automation, Inc., a leading supplier of efficient, cost-effective front-end and back-end automation solutions and engineering services to high volume semiconductor equipment manufacturers, today announced that it has received an order for its ExpressConnectTM integrated automation platform.

13 Jul 2010