Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that STMicroelectronics, a global leader in integrated circuits for communications, consumer, computer, automotive and industrial applications, has standardized on Cadence® QRC Extraction for their 40-nanometer custom/analog designs.
Min-Feng Yu, a professor of mechanical science and engineering, and his graduate student have developed a novel approach for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.
Cooperation between semiconductor manufacturers, materials and equipment suppliers, and researchers has ensured that the European microelectronics industry can continue to maintain its global position in consumer electronics product design and manufacture.
NEXX Systems– a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat sputter tool order for an Apollo physical vapor deposition system ...
Mitsubishi Electric Corporation announced today it plans to invest 6.5 billion yen to expand its wafer production capacity for power devices by approximately 2.5 times that of the previous fiscal year. The expansion, to be conducted in several stages, will be completed by April 2011.
Cymer, Inc. (NASDAQ:CYMI) , the market's leading developer of light sources used to pattern advanced semiconductor chips, announced today the introduction of the ELS(TM) 7010x, the world's first field-selectable 30 ...
Texas Instruments Incorporated (TI) said today it will purchase two wafer fabs and manufacturing equipment located in Aizu-Wakamatsu, Japan. The assets currently are operated by Spansion Japan Limited (SJL) and are being acquired under a court-approved plan of reorganization.
Toshiba Corporation (Tokyo: 6502) today announced that it has started construction of a state-of-the-art fabrication facility (fab), Fab 5, at Yokkaichi Operations, its memory production facility in Mie Prefecture, with ...
Advanced Diamond Technologies (ADT) received a Phase I Small Business Innovation Research (SBIR) grant from the National Science Foundation (NSF) to develop the next generation of chemical mechanical planarization (CMP) pad conditioners for the semiconductor industry.
Rice University scientists have found the "ultimate" solvent for all kinds of carbon nanotubes (CNTs), a breakthrough that brings the creation of a highly conductive quantum nanowire ever closer.
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