Nanoelectronics News

RSS

Imec Demonstrates Value of SiGe above-IC MEMS Technology Platform

Imec demonstrates the value of its SiGe above-IC MEMS technology platform for improving performance of state-of-the-art MEMS with the development of new MEMS devices. The new devices are a 15µm SiGe micromirror and a grating light valve for high-resolution displays.

From IMEC 13 Jul 2010

Imec and ASML Qualifies ASML's Tachyon and FlexRay

Imec and ASML collaborated to qualify ASML’s Tachyon Source Mask Optimization and programmable illuminator system FlexRay™, proving its potential with the demonstration of a 22nm SRAM memory cell.

From IMEC 13 Jul 2010

Imec Sets Major Step Towards 20nm Half Pitch Interconnects

Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach.

From IMEC 13 Jul 2010

Imec Large-Area Epitaxial Solar Cell with Efficiency of 16.3% on High-Quality Substrate

Imec realized large-area (70cm2) epitaxial solar cells with efficiencies of up to 16.3% on high-quality substrates. And efficiencies of up to 14.7% were achieved on large-area low-quality substrates, showing the potential of thin-film epitaxial solar cells for industrial manufacturing.

From IMEC 13 Jul 2010

Imec Reports Promising Results in Extreme Ultraviolet Lithography Mask Cleaning Program

Imec today reports promising results in its Extreme Ultraviolet Lithography (EUV) mask cleaning program for defect-free EUV masks which are crucial in achieving high chip manufacturing yield.

From IMEC 13 Jul 2010

Micron Technology, Applied Materials, and Ultratech Joins imec IIAP on GaN-on-Si Technology

Micron Technology, Applied Materials, and Ultratech have joined the imec industrial affiliation program (IIAP) on GaN-on-Si technology. This multi-partner R+D program focuses on the development of GaN-on-Si (gallium nitr...

From IMEC 13 Jul 2010

Applied Materials’ Endura System Marks 20 Years of Achievement

Applied Materials, Inc. today celebrates the 20th year of its Applied Endura® platform, the most successful metallization system in the history of the semiconductor industry.

From Applied Materials Inc. 13 Jul 2010

UAT Expands Wafer Bumping Facility in Malaysia

Unisem Advanced Technologies (UAT) announced today that it is expanding wafer bumping capacity in its factory in Ipoh, Malaysia.

13 Jul 2010

Bayer MaterialScience Joins Holst Centre Flexible Electronics Research

Bayer MaterialScience AG, one of the world's largest producers of polymers and high-performance plastics, and Holst Centre, an open-innovation initiative by research organizations IMEC (Belgium) and TNO (The Netherla...

13 Jul 2010

Rudolph’s NSX System Chosen for MEMS Processing by Fraunhofer ISIT

Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology (ISIT) in Germany has placed an order for an NSX® Series Macro Inspection System for advanced MEMS processing.

From Onto Innovation 13 Jul 2010